Bottoms; Wilmer R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bottoms; Wilmer R..The latest application filed is for "flexible dut interface assembly".
- Bottoms; Wilmer R. - Palo Alto CA
| Patent | Date |
|---|---|
| High density interconnect system for IC packages and interconnect assemblies Grant 7,812,626 - Bottoms , et al. October 12, 2 | 2010-10-12 |
| High density interconnect system for IC packages and interconnect assemblies Grant 7,579,848 - Bottoms , et al. August 25, 2 | 2009-08-25 |
| Flexible DUT interface assembly App 20040066207 - Bottoms, Wilmer R. ; et al. | 2004-04-08 |
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