Bottoms; W.R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bottoms; W.R..The latest application filed is for "construction structures and manufacturing processes for integrated circuit wafer probe card assemblies".
- Bottoms; W.R. - Palo Alto CA
| Patent | Date |
|---|---|
| Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies App 20120212248 - Chong; Fu Chiung ; et al. | 2012-08-23 |
| Construction Structures And Manufacturing Processes For Integrated Circuit Wafer Probe Card Assemblies App 20120023730 - CHONG; Fu Chiung ; et al. | 2012-02-02 |
| High Density Interconnect System For Ic Packages And Interconnect Assemblies App 20100066393 - Bottoms; W. R. ; et al. | 2010-03-18 |
| Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies App 20100026331 - Chong; Fu Chiung ; et al. | 2010-02-04 |
| Fine Pitch Microfabricated Spring Contact Structure & Method App 20070245553 - CHONG; Fu Chiung ; et al. | 2007-10-25 |
| High density interconnect system for IC packages and interconnect assemblies App 20060186906 - Bottoms; W. R. ; et al. | 2006-08-24 |
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