Bottema; Brian E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bottema; Brian E..The latest application filed is for "process of using a polishing apparatus including a platen window and a polishing pad".

Company Profile

0.8.6

Bottema; Brian E. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process of using a polishing apparatus including a platen window and a polishing pad Grant 7,892,070 - Bottema , et al. February 22, 2	2011-02-22
Grooved platen with channels or pathway to ambient air Grant 7,534,162 - Bottema , et al. May 19, 2	2009-05-19
Platen endpoint window with pressure relief Grant 7,520,797 - Bottema , et al. April 21, 2	2009-04-21
Polishing pad, a polishing apparatus, and a process for using the polishing pad Grant 7,497,763 - Bottema , et al. March 3, 2	2009-03-03
Process Of Using A Polishing Apparatus Including A Platen Window And A Polishing Pad App 20090023363 - Bottema; Brian E. ; et al.	2009-01-22
Polishing pad, a polishing apparatus, and a process for using the polishing pad App 20070224917 - Bottema; Brian E. ; et al.	2007-09-27
Platen endpoint window with pressure relief App 20070054602 - Bottema; Brian E. ; et al.	2007-03-08
Grooved platen with channels or pathway to ambient air App 20070054601 - Bottema; Brian E. ; et al.	2007-03-08
Polishing pad, a polishing apparatus, and a process for using the polishing pad Grant 7,179,151 - Bottema , et al. February 20, 2	2007-02-20
Polishing carrier head with a modified pressure profile Grant 7,074,118 - Bottema , et al. July 11, 2	2006-07-11
Polishing system having a carrier head with substrate presence sensing Grant 6,905,392 - Bottema , et al. June 14, 2	2005-06-14
Chemical mechanical polish (CMP) conditioning-disk holder Grant 6,887,138 - Bottema , et al. May 3, 2	2005-05-03
Polishing system having a carrier head with substrate presence sensing App 20040266324 - Bottema, Brian E. ; et al.	2004-12-30
Chemical mechanical polish (CMP) conditioning-disk holder App 20040259487 - Bottema, Brian E. ; et al.	2004-12-23

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