Patent | Date |
---|
Fully differential, high Q, on-chip, impedance matching section Grant 8,274,353 - Barrett , et al. September 25, 2 | 2012-09-25 |
System and method allowing for safe use of a headset Grant 8,270,629 - Bothra , et al. September 18, 2 | 2012-09-18 |
Fully Differential, High Q, On-Chip, Impedance Matching Section App 20110163831 - Barrett; Carol ;   et al. | 2011-07-07 |
Fully differential, high Q, on-chip, impedance matching section Grant 7,911,310 - Barrett , et al. March 22, 2 | 2011-03-22 |
Method to implement metal fill during integrated circuit design and layout Grant 7,614,024 - Bothra November 3, 2 | 2009-11-03 |
Fully Differential, High Q, On-Chip, Impedance Matching Section App 20090127654 - Barrett; Carol ;   et al. | 2009-05-21 |
Fully differential, high Q, on-chip, impedance matching section Grant 7,489,221 - Barrett , et al. February 10, 2 | 2009-02-10 |
I/O driver power distribution method for reducing silicon area Grant 7,434,189 - Baumann , et al. October 7, 2 | 2008-10-07 |
Power supply integration for low power single chip RF CMOS solutions for use in battery operated electronic devices App 20070210775 - Bothra; Subhas ;   et al. | 2007-09-13 |
System and method allowing for safe use of a headset App 20070092087 - Bothra; Subhas ;   et al. | 2007-04-26 |
I/O driver power distribution method for reducing silicon area App 20070090401 - Baumann; Donald ;   et al. | 2007-04-26 |
Method to implement metal fill during integrated circuit design and layout App 20070083833 - Bothra; Subhas | 2007-04-12 |
Fully differential, high Q, on-chip, impedance matching section App 20060273874 - Barrett; Carol ;   et al. | 2006-12-07 |
Fully differential, high Q, on-chip, impedance matching section Grant 7,095,307 - Barrett , et al. August 22, 2 | 2006-08-22 |
Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection Grant 6,916,525 - Bothra , et al. July 12, 2 | 2005-07-12 |
Pad metallization over active circuitry Grant 6,787,908 - Skala , et al. September 7, 2 | 2004-09-07 |
Semiconductor pressure transducer structures and methods for making the same Grant 6,756,316 - Bothra , et al. June 29, 2 | 2004-06-29 |
Semiconductor inductor and methods for making the same Grant 6,717,232 - Bothra April 6, 2 | 2004-04-06 |
Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection App 20040058543 - Bothra, Subhas ;   et al. | 2004-03-25 |
Structure to increase density of MIM capacitors between adjacent metal layers in an integrated circuit Grant 6,710,425 - Bothra March 23, 2 | 2004-03-23 |
Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection Grant 6,649,253 - Bothra , et al. November 18, 2 | 2003-11-18 |
Semiconductor inductor and methods for making the same App 20030170989 - Bothra, Subhas | 2003-09-11 |
Methods for making semiconductor inductor Grant 6,573,148 - Bothra June 3, 2 | 2003-06-03 |
Methods for forming co-axial interconnect lines in a CMOS process for high speed applications Grant 6,569,757 - Weling , et al. May 27, 2 | 2003-05-27 |
Methods for implementing co-axial interconnect lines in a CMOS process for high speed RF and microwave applications Grant 6,545,338 - Bothra , et al. April 8, 2 | 2003-04-08 |
Structure and method to increase density of MIM capacitors in damascene process App 20020192919 - Bothra, Subhas | 2002-12-19 |
Seal ring structure for IC containing integrated digital/RF/analog circuits and functions Grant 6,492,716 - Bothra , et al. December 10, 2 | 2002-12-10 |
Modified optics for imaging of lens limited subresolution features Grant 6,411,367 - Baker , et al. June 25, 2 | 2002-06-25 |
Process to control poly silicon profiles in a dual doped poly silicon process Grant 6,399,432 - Zheng , et al. June 4, 2 | 2002-06-04 |
Method for reducing the capacitance between interconnects by forming voids in dielectric material Grant 6,387,797 - Bothra , et al. May 14, 2 | 2002-05-14 |
Use of optimized film stacks for increasing absorption for laser repair of fuse links Grant 6,372,522 - Weling , et al. April 16, 2 | 2002-04-16 |
Automated design of on-chip capacitive structures for suppressing inductive noise Grant 6,327,695 - Bothra , et al. December 4, 2 | 2001-12-04 |
Intelligent gate-level fill methods for reducing global pattern density effects Grant 6,323,113 - Gabriel , et al. November 27, 2 | 2001-11-27 |
Method for determining nitrogen concentration in a film of nitrided oxide material Grant 6,313,466 - Olsen , et al. November 6, 2 | 2001-11-06 |
Process to improve adhesion of PECVD cap layers in integrated circuits Grant 6,303,192 - Annapragada , et al. October 16, 2 | 2001-10-16 |
Pad metallization over active circuitry App 20010026018 - Skala, Stephen L. ;   et al. | 2001-10-04 |
Air gap dielectric in self-aligned via structures Grant 6,281,585 - Bothra August 28, 2 | 2001-08-28 |
Methods and apparatus for design rule checking Grant 6,275,971 - Levy , et al. August 14, 2 | 2001-08-14 |
Reduced gate length transistor structures and methods for fabricating the same App 20010009792 - Bothra, Subhas ;   et al. | 2001-07-26 |
Electromigration impeding composite metallization lines and methods for making the same Grant 6,191,481 - Bothra , et al. February 20, 2 | 2001-02-20 |
Design level optical proximity correction methods Grant 6,189,136 - Bothra February 13, 2 | 2001-02-13 |
Methods of forming a semiconductor device Grant 6,176,983 - Bothra , et al. January 23, 2 | 2001-01-23 |
Electromigration bonding process and system Grant 6,156,626 - Bothra December 5, 2 | 2000-12-05 |
Method for preventing electrochemical erosion of interconnect structures Grant 6,153,531 - Bothra , et al. November 28, 2 | 2000-11-28 |
Programmable semiconductor structures and methods for making the same Grant 6,143,642 - Sur, Jr. , et al. November 7, 2 | 2000-11-07 |
Method for forming vias through porous dielectric material and devices formed thereby Grant 6,140,221 - Annapragada , et al. October 31, 2 | 2000-10-31 |
Process for making self-aligned conductive via structures Grant 6,133,635 - Bothra , et al. October 17, 2 | 2000-10-17 |
Method of making photo alignment structure Grant 6,133,111 - Sur , et al. October 17, 2 | 2000-10-17 |
Semiconductor manufacturing apparatus and method for measuring in-situ pressure across a wafer Grant 6,129,613 - Bothra October 10, 2 | 2000-10-10 |
Micro-electromechanical system and voltage shifter, method of synchronizing an electronic system and a micromechanical system of a micro-electromechanical system Grant 6,127,811 - Shenoy , et al. October 3, 2 | 2000-10-03 |
Methods for making semiconductor devices having air dielectric interconnect structures Grant 6,057,224 - Bothra , et al. May 2, 2 | 2000-05-02 |
Hexagonal semiconductor die, semiconductor substrates, and methods of forming a semiconductor die Grant 6,030,885 - Bothra February 29, 2 | 2000-02-29 |
Composite metallization structures for improved post bonding reliability Grant 6,020,647 - Skala , et al. February 1, 2 | 2000-02-01 |
Apparatus for automated pillar layout and method for implementing same Grant 6,013,536 - Nowak , et al. January 11, 2 | 2000-01-11 |
Process for manufacturing ultra-sharp atomic force microscope (AFM) and scanning tunneling microscope (STM) tips Grant 5,965,218 - Bothra , et al. October 12, 1 | 1999-10-12 |
Use of dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing Grant 5,965,941 - Weling , et al. October 12, 1 | 1999-10-12 |
Parasitic resistance measuring device Grant 5,933,020 - Bothra August 3, 1 | 1999-08-03 |
Methods and apparatus for polishing wafers Grant 5,916,016 - Bothra June 29, 1 | 1999-06-29 |
Method for producing deep submicron interconnect vias Grant 5,915,203 - Sengupta , et al. June 22, 1 | 1999-06-22 |
Reliable interconnect via structures and methods for making the same Grant 5,913,141 - Bothra June 15, 1 | 1999-06-15 |
Micro-electromechanical voltage shifter Grant 5,889,389 - Bothra , et al. March 30, 1 | 1999-03-30 |
Low power programmable fuse structures and methods for making the same Grant 5,882,998 - Sur, Jr. , et al. March 16, 1 | 1999-03-16 |
Method for making devices having thin load structures Grant 5,882,997 - Sur, Jr. , et al. March 16, 1 | 1999-03-16 |
Moisture barrier gap fill structure and method for making the same Grant 5,880,519 - Bothra , et al. March 9, 1 | 1999-03-09 |
Photo alignment structure Grant 5,877,562 - Sur , et al. March 2, 1 | 1999-03-02 |
Method of making high resistive structures in salicided process semiconductor devices Grant 5,834,356 - Bothra , et al. November 10, 1 | 1998-11-10 |
Integrated circuit structure having an air dielectric and dielectric support pillars Grant 5,798,559 - Bothra , et al. August 25, 1 | 1998-08-25 |
Dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing Grant 5,639,697 - Weling , et al. June 17, 1 | 1997-06-17 |
Method of making microscope probe tips Grant 5,540,958 - Bothra , et al. July 30, 1 | 1996-07-30 |