Bossio; Michael J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bossio; Michael J..The latest application filed is for "method of refining solder materials".
- Bossio; Michael J. - Spokane WA
| Patent | Date |
|---|---|
| Method of refining solder materials Grant 9,666,547 - Weiser , et al. May 30, 2 | 2017-05-30 |
| Method Of Refining Solder Materials App 20100206133 - Weiser; Martin W. ; et al. | 2010-08-19 |
| Methods of refining lead-containing materials Grant 7,521,286 - Weiser , et al. April 21, 2 | 2009-04-21 |
| Lead-containing solder bumps App 20070045842 - Weiser; Martin W. ; et al. | 2007-03-01 |
| Lead-containing solder paste App 20070045839 - Weiser; Martin W. ; et al. | 2007-03-01 |
| Lead-containing anodes App 20070045838 - Weiser; Martin W. ; et al. | 2007-03-01 |
| Methods of refining lead-containing materials App 20060201279 - Weiser; Martin W. ; et al. | 2006-09-14 |
| Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials App 20040065954 - Weiser, Martin W. ; et al. | 2004-04-08 |
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