Borski; Justin C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Borski; Justin C..The latest application filed is for "methods and devices for miniaturization of high density wafer based electronic 3d multi-chip modules".
- Borski; Justin C. - Bradenton FL
- Borski; Justin C. - Webster MA
| Patent | Date |
|---|---|
| Methods and devices for miniaturization of high density wafer based electronic 3D multi-chip modules Grant 10,453,706 - Kunard , et al. Oc | 2019-10-22 |
| Methods And Devices For Miniaturization Of High Density Wafer Based Electronic 3d Multi-chip Modules App 20160183391 - Kunard; Keith N. ; et al. | 2016-06-23 |
| MEMS actuators Grant 6,858,911 - Tamura , et al. February 22, 2 | 2005-02-22 |
| MEMS actuators App 20030155840 - Tamura, Hirokazu ; et al. | 2003-08-21 |
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