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name:-0.042732954025269
name:-0.021382093429565
name:-0.015689134597778
Borovik; Alexander Patent Filings

Borovik; Alexander

Patent Applications and Registrations

Patent applications and USPTO patent grants for Borovik; Alexander.The latest application filed is for "copper (i) compounds useful as deposition precursors of copper thin films".

Company Profile
0.6.9
  • Borovik; Alexander - White Plains NY
  • Borovik; Alexander - Elmsford NY
  • Borovik; Alexander - West Hartford CT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Fluorine-free trisiloxane surfactant compositions for use in coatings and printing ink compositions
Grant 7,964,032 - Rajaraman , et al. June 21, 2
2011-06-21
Copper (i) Compounds Useful As Deposition Precursors Of Copper Thin Films
App 20100133689 - Xu; Chongying ;   et al.
2010-06-03
Copper (i) Compounds Useful As Deposition Precursors Of Copper Thin Films
App 20080233276 - Xu; Chongying ;   et al.
2008-09-25
Fluorine-free disiloxane surfactant compositions for use in coatings and printing ink compositions
Grant 7,399,350 - Rajaraman , et al. July 15, 2
2008-07-15
Copper (I) compounds useful as deposition precursors of copper thin films
Grant 7,371,880 - Xu , et al. May 13, 2
2008-05-13
Fluorine-free trisiloxane surfactant compositions for use in coatings and printing ink compositions
App 20080090963 - Rajaraman; Suresh K. ;   et al.
2008-04-17
Fluorine-free disiloxane surfactant compositions for use in coatings and printing ink compositions
App 20080090964 - Rajaraman; Suresh K. ;   et al.
2008-04-17
Copper (I) compounds useful as deposition precursors of copper thin films
Grant 7,241,912 - Xu , et al. July 10, 2
2007-07-10
Copper (i) Compounds Useful As Deposition Precursors Of Copper Thin Films
App 20070116876 - Xu; Chongying ;   et al.
2007-05-24
Copper (I) compounds useful as deposition precursors of copper thin films
Grant 7,166,732 - Xu , et al. January 23, 2
2007-01-23
Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products
App 20060065294 - Xu; Chongying ;   et al.
2006-03-30
Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products
Grant 7,011,716 - Xu , et al. March 14, 2
2006-03-14
Copper (i) Compounds Useful As Deposition Precursors Of Copper Thin Films
App 20050281952 - Xu, Chongying ;   et al.
2005-12-22
Copper (I) compounds useful as deposition precursors of copper thin films
App 20050283012 - Xu, Chongying ;   et al.
2005-12-22
Compositions And Methods For Drying Patterned Wafers During Manufacture Of Integrated Circuitry Products
App 20040216772 - Xu, Chongying ;   et al.
2004-11-04

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