Booth; Richard B.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Booth; Richard B..The latest application filed is for "pretreated material for laser sintering".
- Booth; Richard B. - Bluffton TX
- Booth; Richard B. - Novi MI
- Booth; Richard B. - Pflugerville TX
- Booth; Richard B. - Williamson County TX
- Booth; Richard B. - Wappingers Falls NY
| Patent | Date |
|---|---|
| Pretreated Material for Laser Sintering App 20220134642 - Booth; Richard B. ; et al. | 2022-05-05 |
| Biodegradeable Plastics For Use In Additive Manufacturing Processes App 20210331382 - Vanelli; Donald L. ; et al. | 2021-10-28 |
| Biodegradable Material For Additive Manufacture App 20210206961 - Vanelli; Donald L. ; et al. | 2021-07-08 |
| Method Of Manufacturing A Permanent Magnet App 20210050149 - Booth; Richard B. | 2021-02-18 |
| Selective laser sintering of polymer powder of controlled particle size distribution Grant 5,817,206 - McAlea , et al. October 6, 1 | 1998-10-06 |
| Method of forming three-dimensional articles using thermosetting materials Grant 5,749,041 - Lakshminarayan , et al. May 5, 1 | 1998-05-05 |
| Direct chip attachment (DCA) with electrically conductive adhesives Grant 5,747,101 - Booth , et al. May 5, 1 | 1998-05-05 |
| Direct chip attachment (DCA) with electrically conductive adhesives Grant 5,543,585 - Booth , et al. August 6, 1 | 1996-08-06 |
| Parallel process interposer (PPI) Grant 5,404,044 - Booth , et al. April 4, 1 | 1995-04-04 |
| Method of fabricating a multi-layer integrated circuit chip interposer Grant 5,386,627 - Booth , et al. February 7, 1 | 1995-02-07 |
| Method for replacing IC chip package interposer Grant 5,384,955 - Booth , et al. January 31, 1 | 1995-01-31 |
| Process for making a compliant thermally conductive compound Grant 5,213,704 - Anderson, Jr. , et al. May 25, 1 | 1993-05-25 |
| Liquid metal matrix thermal paste Grant 5,198,189 - Booth , et al. March 30, 1 | 1993-03-30 |
| Liquid metal matrix thermal paste Grant 5,173,256 - Booth , et al. December 22, 1 | 1992-12-22 |
| Compliant thermally conductive compound Grant 5,094,769 - Anderson, Jr. , et al. March 10, 1 | 1992-03-10 |
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