Boon; Tan Juan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Boon; Tan Juan.The latest application filed is for "integrated circuits including copper pillar structures and methods for fabricating the same".
- Boon; Tan Juan - Singapore SG
| Patent | Date |
|---|---|
| Integrated Circuits Including Copper Pillar Structures And Methods For Fabricating The Same App 20150187714 - Bhatkar; Mahesh Anant ; et al. | 2015-07-02 |
| Structure and method for fabricating a bond pad structure Grant 7,276,797 - Fan , et al. October 2, 2 | 2007-10-02 |
| Use of phoslon (PNO) for borderless contact fabrication, etch stop/barrier layer for dual damascene fabrication and method of forming phoslon Grant 7,148,157 - Choo , et al. December 12, 2 | 2006-12-12 |
| Structure and method for fabricating a bond pad structure App 20060071350 - Fan; Zhang ; et al. | 2006-04-06 |
| Structure and method for fabricating a bond pad structure Grant 6,998,335 - Fan , et al. February 14, 2 | 2006-02-14 |
| Method to fabricate aligned dual damacene openings App 20060003573 - Lim; Yeow Kheng ; et al. | 2006-01-05 |
| Use of phoslon (PNO) for borderless contact fabrication, etch stop/barrier layer for dual damascene fabrication and method of forming phoslon App 20040077181 - Choo, Hsia Liang ; et al. | 2004-04-22 |
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