Boon; Suan Jeung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Boon; Suan Jeung.The latest application filed is for "packaged semiconductor assemblies and methods for manufacturing such assemblies".

Company Profile

2.60.43

Boon; Suan Jeung - Singapore SG
Boon; Suan Jeung - Jin Kayu SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20220013460 - Boon; Suan Jeung ; et al.	2022-01-13
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20200243444 - Boon; Suan Jeung ; et al.	2020-07-30
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 10,622,308 - Boon , et al.	2020-04-14
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 10,396,059 - Eng , et al. A	2019-08-27
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20180323179 - Eng; Meow Koon ; et al.	2018-11-08
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 10,056,359 - Eng , et al. August 21, 2	2018-08-21
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20180158778 - Boon; Suan Jeung ; et al.	2018-06-07
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 9,911,696 - Boon , et al. March 6, 2	2018-03-06
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20170207206 - Eng; Meow Koon ; et al.	2017-07-20
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 9,653,444 - Eng , et al. May 16, 2	2017-05-16
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20160099237 - Eng; Meow Koon ; et al.	2016-04-07
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 9,165,910 - Eng , et al. October 20, 2	2015-10-20
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20150091166 - Eng; Meow Koon ; et al.	2015-04-02
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 8,906,744 - Eng , et al. December 9, 2	2014-12-09
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20140124960 - Boon; Suan Jeung ; et al.	2014-05-08
Super high-density module with integrated wafer level packages Grant 8,698,295 - Chia , et al. April 15, 2	2014-04-15
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20140015130 - Eng; Meow Koon ; et al.	2014-01-16
Wafer level packaging Grant 8,564,106 - Chua , et al. October 22, 2	2013-10-22
Method for packaging circuits Grant 8,555,495 - Chia , et al. October 15, 2	2013-10-15
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 8,536,702 - Eng , et al. September 17, 2	2013-09-17
Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods Grant 8,525,320 - Eng , et al. September 3, 2	2013-09-03
Interconnects for packaged semiconductor devices and methods for manufacturing such devices Grant 8,445,330 - Boon , et al. May 21, 2	2013-05-21
Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material Grant 8,362,594 - Chua , et al. January 29, 2	2013-01-29
Super high-density module with integrated wafer level packages Grant 8,304,894 - Chia , et al. November 6, 2	2012-11-06
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 8,232,657 - Boon , et al. July 31, 2	2012-07-31
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 8,198,720 - Eng , et al. June 12, 2	2012-06-12
Wafer Level Packaging App 20120119263 - Chua; Swee Kwang ; et al.	2012-05-17
Method For Packaging Circuits App 20120064697 - Chia; Yong Poo ; et al.	2012-03-15
Wafer level packaging Grant 8,106,488 - Chua , et al. January 31, 2	2012-01-31
Method for packaging circuits Grant 8,065,792 - Chia , et al. November 29, 2	2011-11-29
Semiconductor device assemblies and packages Grant 8,063,493 - Boon , et al. November 22, 2	2011-11-22
Wafer level pre-packaged flip chip Grant 7,943,422 - Boon May 17, 2	2011-05-17
Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die Grant 7,915,711 - Chua , et al. March 29, 2	2011-03-29
Super high density module with integrated wafer level packages Grant 7,884,007 - Chia , et al. February 8, 2	2011-02-08
Wafer Level Packaging App 20110018143 - Chua; Swee Kwang ; et al.	2011-01-27
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 7,855,462 - Boon , et al. December 21, 2	2010-12-21
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Grant 7,843,050 - Eng , et al. November 30, 2	2010-11-30
Wafer level packaging Grant 7,820,484 - Chua , et al. October 26, 2	2010-10-26
Wafer level pre-packaged flip chip Grant 7,812,447 - Boon October 12, 2	2010-10-12
Wafer level pre-packaged flip chip system Grant 7,808,112 - Boon October 5, 2	2010-10-05
Interconnects for packaged semiconductor devices and methods for manufacturing such devices Grant 7,791,203 - Boon , et al. September 7, 2	2010-09-07
Method For Packaging Circuits And Packaged Circuits App 20100146780 - Chia; Yong Poo ; et al.	2010-06-17
Method for packaging circuits and packaged circuits Grant 7,712,211 - Chia , et al. May 11, 2	2010-05-11
Semiconductor Device Assemblies And Packages With Edge Contacts And Sacrificial Substrates And Other Intermediate Structures Used Or Formed In Fabricating The Assemblies Or Packages App 20100072603 - Boon; Suan Jeung ; et al.	2010-03-25
Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material Grant 7,674,655 - Chua , et al. March 9, 2	2010-03-09
Wafer level pre-packaged flip chip systems Grant 7,646,102 - Boon January 12, 2	2010-01-12
Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages Grant 7,633,159 - Boon , et al. December 15, 2	2009-12-15
Super high density module with integrated wafer level packages Grant 7,579,681 - Chia , et al. August 25, 2	2009-08-25
Multiple chip semiconductor package Grant 7,553,697 - Eng , et al. June 30, 2	2009-06-30
Method of making multichip wafer level packages and computing systems incorporating same Grant 7,485,562 - Chua , et al. February 3, 2	2009-02-03
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20090014858 - Boon; Suan Jeung ; et al.	2009-01-15
Wafer Level Packaging App 20080211113 - Chua; Swee Kwang ; et al.	2008-09-04
Method of forming a conductive via through a wafer Grant 7,375,009 - Chua , et al. May 20, 2	2008-05-20
Super high density module with integrated wafer level packages Grant 7,368,374 - Chia , et al. May 6, 2	2008-05-06
Castellation wafer level packaging of integrated circuit chips Grant 7,304,375 - Boon , et al. December 4, 2	2007-12-04
Super High Density Module with Integrated Wafer Level Packages App 20070264751 - Chia; Yong Poo ; et al.	2007-11-15
Leadless packaging for image sensor devices Grant 7,274,094 - Boon , et al. September 25, 2	2007-09-25
Castellation wafer level packaging of integrated circuit chips Grant 7,271,027 - Boon , et al. September 18, 2	2007-09-18
Super high density module with integrated wafer level packages App 20070152327 - Chia; Yong Poo ; et al.	2007-07-05
Super high density module with integrated wafer level packages App 20070145558 - Chia; Yong Poo ; et al.	2007-06-28
Castellated chip-scale packages and methods for fabricating the same Grant 7,208,335 - Boon , et al. April 24, 2	2007-04-24
Castellation wafer level packaging of integrated circuit chips Grant 7,193,312 - Boon , et al. March 20, 2	2007-03-20
Multiple chip semiconductor package App 20070059862 - Eng; Meow Koon ; et al.	2007-03-15
Multiple chip semiconductor package Grant 7,173,330 - Eng , et al. February 6, 2	2007-02-06
Wafer level pre-packaged flip chip systems App 20060261493 - Boon; Suan Jeung	2006-11-23
Wafer Level Pre-packaged Flip Chip System App 20060255475 - Boon; Suan Jeung	2006-11-16
Leadless packaging for image sensor devices and methods of assembly Grant 7,112,471 - Boon , et al. September 26, 2	2006-09-26
Multichip wafer level packages and computing systems incorporating same Grant 7,087,992 - Chua , et al. August 8, 2	2006-08-08
Multiple chip semiconductor package and method of fabricating same Grant 6,987,031 - Eng , et al. January 17, 2	2006-01-17
Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages App 20060006521 - Boon; Suan Jeung ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060001143 - Boon; Suan Jeung ; et al.	2006-01-05
Multi-chip wafer level system packages and methods of forming same Grant 6,964,881 - Chua , et al. November 15, 2	2005-11-15
Multiple chip semiconductor package and method of fabricating same App 20050236709 - Eng, Meow Koon ; et al.	2005-10-27
Multiple chip semiconductor package Grant 6,958,537 - Eng , et al. October 25, 2	2005-10-25
Method of making multichip wafer level packages and computing systems incorporating same App 20050116337 - Chua, Swee Kwang ; et al.	2005-06-02
Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead Grant 6,882,021 - Boon , et al. April 19, 2	2005-04-19
Multichip wafer level packages and computing systems incorporating same App 20050073029 - Chua, Swee Kwang ; et al.	2005-04-07
Castellated chip-scale packages and methods for fabricating the same App 20050067680 - Boon, Suan Jeung ; et al.	2005-03-31
Super high density module with integrated wafer level packages App 20050048695 - Chia, Yong Poo ; et al.	2005-03-03
Methods and apparatus for testing and burn-in of semiconductor devices Grant 6,856,155 - Tay , et al. February 15, 2	2005-02-15
Multiple chip semiconductor package App 20050006748 - Eng, Meow Koon ; et al.	2005-01-13
Packaged microelectronic devices and methods of packaging microelectronic devices App 20040238909 - Boon, Suan Jeung ; et al.	2004-12-02
Multichip wafer level packages and computing systems incorporating same Grant 6,825,553 - Chua , et al. November 30, 2	2004-11-30
Multichip wafer level system packages and methods of forming same App 20040229400 - Chua, Swee Kwang ; et al.	2004-11-18
Method for packaging circuits and packaged circuits App 20040221451 - Chia, Yong Poo ; et al.	2004-11-11
Method of packaging at a wafer level App 20040113246 - Boon, Suan Jeung	2004-06-17
Electronic apparatus having an adhesive layer from wafer level packaging App 20040104486 - Boon, Suan Jeung	2004-06-03
Leadless packaging for image sensor devices and methods of assembly App 20040084741 - Boon, Suan Jeung ; et al.	2004-05-06
Adhesive layer for an electronic apparatus having multiple semiconductor devices Grant 6,710,454 - Boon March 23, 2	2004-03-23
Multichip wafer level packages and computing systems incorporating same App 20040046250 - Chua, Swee Kwang ; et al.	2004-03-11
Leadless packaging for image sensor devices and methods of assembly App 20040041221 - Boon, Suan Jeung ; et al.	2004-03-04
Multiple chip semiconductor package and method of fabricating same App 20040042190 - Eng, Meow Koon ; et al.	2004-03-04
Multi-chip wafer level system packages and methods of forming same App 20040043533 - Chua, Swee Kwang ; et al.	2004-03-04
Methods and apparatus for testing and burn-in of semiconductor devices App 20040032273 - Tay, Wuu Yean ; et al.	2004-02-19
Wafer level packaging App 20030232488 - Chua, Swee Kwang ; et al.	2003-12-18
Super high density module with integrated wafer level packages App 20030227079 - Chia, Yong Poo ; et al.	2003-12-11