Bonner; Benjamin A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bonner; Benjamin A..The latest application filed is for "cvd based metal/semiconductor ohmic contact for high volume manufacturing applications".

Company Profile

0.10.17

Bonner; Benjamin A. - San Jose CA
Bonner; Benjamin A. - San Mateo CA
Bonner; Benjamin A. - Campbell CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
CVD based metal/semiconductor OHMIC contact for high volume manufacturing applications Grant 9,153,486 - Arghavani , et al. October 6, 2	2015-10-06
Cvd Based Metal/semiconductor Ohmic Contact For High Volume Manufacturing Applications App 20140308812 - Arghavani; Reza ; et al.	2014-10-16
Method Of Forming Polishing Sheet App 20140237905 - Bonner; Benjamin A. ; et al.	2014-08-28
Partial Contact Wafer Retaining Ring Apparatus App 20100120335 - Fang; Haoquan ; et al.	2010-05-13
Monolithic Linear Polishing Sheet App 20100112919 - Bonner; Benjamin A. ; et al.	2010-05-06
Polishing apparatus with grooved subpad Grant 7,601,050 - Zuniga , et al. October 13, 2	2009-10-13
Leader And Trailer For Linear Polishing Sheet App 20090088051 - Menk; Gregory E. ; et al.	2009-04-02
Materials for chemical mechanical polishing Grant 7,429,210 - Bonner , et al. September 30, 2	2008-09-30
High Selectivity Slurry Compositions For Chemical Mechanical Polishing App 20070218693 - Bonner; Benjamin A. ; et al.	2007-09-20
Smart polishing media assembly for planarizing substrates App 20070212976 - McReynolds; Peter ; et al.	2007-09-13
Polishing apparatus with grooved subpad App 20070197141 - Zuniga; Steven M. ; et al.	2007-08-23
Polishing system with spiral-grooved subpad App 20070197147 - Rondum; Erik S. ; et al.	2007-08-23
Materials For Chemical Mechanical Polishing App 20070117500 - BONNER; BENJAMIN A. ; et al.	2007-05-24
Materials for chemical mechanical polishing Grant 7,179,159 - Bonner , et al. February 20, 2	2007-02-20
Materials for chemical mechanical polishing App 20060246831 - Bonner; Benjamin A. ; et al.	2006-11-02
High selectivity slurry compositions for chemical mechanical polishing App 20060097219 - Bonner; Benjamin A. ; et al.	2006-05-11
Carrier head with a modified flexible membrane Grant 6,855,043 - Tang , et al. February 15, 2	2005-02-15
Closed loop control over delivery of liquid material to semiconductor processing tool Grant 6,834,777 - Osterheld , et al. December 28, 2	2004-12-28
Methods and compositions for chemical mechanical polishing shallow trench isolation substrates Grant 6,811,470 - Bonner , et al. November 2, 2	2004-11-02
Closed loop control over delivery of liquid material to semiconductor processing tool App 20030189060 - Osterheld, Thomas H. ; et al.	2003-10-09
Closed loop control over delivery of liquid material to semiconductor processing tool Grant 6,561,381 - Osterheld , et al. May 13, 2	2003-05-13
Methods and compositions for chemical mechanical polishing shallow trench isolation substrates App 20030036339 - Bonner, Benjamin A. ; et al.	2003-02-20
Multi-step polish process to control uniformity when using a selective slurry on patterned wafers App 20020100743 - Bonner, Benjamin A. ; et al.	2002-08-01
Utility wafer for chemical mechanical polishing Grant 6,361,405 - David , et al. March 26, 2	2002-03-26
Utility wafer for chemical mechanical polishing App 20020028635 - David, Jeffrey D. ; et al.	2002-03-07
Method of post CMP defect stability improvement Grant 6,220,941 - Fishkin , et al. April 24, 2	2001-04-24

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