Bonkohara; Manabu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bonkohara; Manabu.The latest application filed is for "electrode, electrode material, and electrode formation method".

Company Profile

0.13.8

Bonkohara; Manabu - Kanagawa JP
Bonkohara; Manabu - Tokyo JP
Bonkohara; Manabu - Kangawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrode, electrode material, and electrode formation method Grant 9,282,638 - Bonkohara , et al. March 8, 2	2016-03-08
Three-dimensional semiconductor integrated circuit device and method of fabricating the same Grant 8,907,459 - Bonkohara December 9, 2	2014-12-09
Electrode, Electrode Material, And Electrode Formation Method App 20140034354 - Bonkohara; Manabu ; et al.	2014-02-06
Interposer And Semiconductor Module Using The Same App 20140016270 - Bonkohara; Manabu	2014-01-16
Semiconductor Device/electronic Component Mounting Structure App 20140015119 - Bonkohara; Manabu	2014-01-16
Through via/the buried via elrctrolde material and the said via structure and the said via manufacturing method App 20130313687 - Bonkohara; Manabu ; et al.	2013-11-28
Solid-state imaging device, method of fabricating the same, and camera module Grant 8,300,143 - Bonkohara October 30, 2	2012-10-30
Three-dimensional Semiconductor Integrated Circuit Device And Method Of Fabricating The Same App 20110127652 - Bonkohara; Manabu	2011-06-02
Solid-state Imaging Device, Method Of Fabricating The Same, And Camera Module App 20110122303 - Bonkohara; Manabu	2011-05-26
Semiconductor packing stack module and method of producing the same Grant 6,188,127 - Senba , et al. February 13, 2	2001-02-13
Stack module Grant 5,883,426 - Tokuno , et al. March 16, 1	1999-03-16
Semiconductor package with flexible board and method of fabricating the same Grant 5,805,422 - Otake , et al. September 8, 1	1998-09-08
Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics Grant 5,686,763 - Tokuno , et al. November 11, 1	1997-11-11
Chip carrier semiconductor device assembly Grant 5,602,419 - Takeda , et al. February 11, 1	1997-02-11
High density multichip module packaging structure Grant 5,570,274 - Saito , et al. October 29, 1	1996-10-29
Method of manufacturing semiconductor device Grant 4,763,409 - Takekawa , et al. August 16, 1	1988-08-16
Capacitor built-in integrated circuit packaged unit and process of fabrication thereof Grant 4,714,952 - Takekawa , et al. December 22, 1	1987-12-22
Framed lead assembly for a semiconductor device comprising insulator reinforcing strips supported by a frame and made integral with lead strips Grant 4,138,691 - Bonkohara , et al. February 6, 1	1979-02-06

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