Bonifield; Thomas D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bonifield; Thomas D..The latest application filed is for "device isolator with reduced parasitic capacitance".

Company Profile

11.40.41

Bonifield; Thomas D. - Dallas TX
Bonifield; Thomas D - Dallas TX
Bonifield; Thomas D. - Both of Dallas TX
Bonifield; Thomas D. - Garland TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating a thick oxide feature on a semiconductor wafer Grant 11,205,695 - Stewart , et al. December 21, 2	2021-12-21
Device Isolator With Reduced Parasitic Capacitance App 20210367030 - Selvaraj; Raja ; et al.	2021-11-25
Device isolator with reduced parasitic capacitance Grant 11,107,883 - Selvaraj , et al. August 31, 2	2021-08-31
Generating multi-focal defect maps using optical tools Grant 11,087,451 - Stewart , et al. August 10, 2	2021-08-10
Scribe seals and methods of making Grant 11,069,627 - Bonifield , et al. July 20, 2	2021-07-20
Integrated Capacitor With Sidewall Having Reduced Roughness App 20210143249 - STEWART; ELIZABETH COSTNER ; et al.	2021-05-13
Integrated capacitor with sidewall having reduced roughness Grant 10,978,548 - Stewart , et al. April 13, 2	2021-04-13
Hydrogen ventilation of CMOS wafers Grant 10,886,120 - West , et al. January 5, 2	2021-01-05
Methods and apparatus for high voltage integrated circuit capacitors Grant 10,847,605 - West , et al. November 24, 2	2020-11-24
High voltage galvanic isolation device Grant 10,707,297 - West , et al.	2020-07-07
Hydrogen Ventilation Of Cmos Wafers App 20200058485 - West; Jeffrey Alan ; et al.	2020-02-20
Hybrid High and Low Stress Oxide Embedded Capacitor Dielectric App 20190378892 - Stewart; Elizabeth Costner ; et al.	2019-12-12
Method Of Fabricating A Thick Oxide Feature On A Semiconductor Wafer App 20190198604 - Stewart; Elizabeth C. ; et al.	2019-06-27
Generating Multi-focal Defect Maps Using Optical Tools App 20190188839 - STEWART; Elizabeth C. ; et al.	2019-06-20
Device Isolator With Reduced Parasitic Capacitance App 20190148486 - Selvaraj; Raja ; et al.	2019-05-16
High Voltage Galvanic Isolation Device App 20190074350 - West; Jeffrey Alan ; et al.	2019-03-07
Device isolator with reduced parasitic capacitance Grant 10,186,576 - Selvaraj , et al. Ja	2019-01-22
High voltage galvanic isolation device Grant 10,147,784 - West , et al. De	2018-12-04
Crack deflector structure for improving semiconductor device robustness against saw-induced damage Grant 10,109,597 - West , et al. October 23, 2	2018-10-23
Integrated Capacitor With Sidewall Having Reduced Roughness App 20180130870 - STEWART; ELIZABETH COSTNER ; et al.	2018-05-10
Device Isolator With Reduced Parasitic Capacitance App 20180026095 - Selvaraj; Raja ; et al.	2018-01-25
Device isolator with reduced parasitic capacitance Grant 9,806,148 - Selvaraj , et al. October 31, 2	2017-10-31
Methods And Apparatus For High Voltage Integrated Circuit Capacitors App 20170309702 - West; Jeffrey Alan ; et al.	2017-10-26
High breakdown voltage microelectronic device isolation structure with improved reliability Grant 9,768,245 - West , et al. September 19, 2	2017-09-19
High Voltage Galvanic Isolation Device App 20170263696 - West; Jeffrey Alan ; et al.	2017-09-14
Methods and apparatus for high voltage integrated circuit capacitors Grant 9,741,787 - West , et al. August 22, 2	2017-08-22
Methods And Apparatus For High Voltage Integrated Circuit Capacitors App 20170062552 - West; Jeffrey Alan ; et al.	2017-03-02
High breakdown voltage microelectronic device isolation structure with improved reliability Grant 9,583,558 - West , et al. February 28, 2	2017-02-28
Semiconductor Wire Bonding And Method App 20160379953 - Thompson; Patrick Francis ; et al.	2016-12-29
Device Isolator with Reduced Parasitic Capacitance App 20160300907 - Selvaraj; Raja ; et al.	2016-10-13
High Breakdown Voltage Microelectronic Device Isolation Structure with Improved Reliability App 20160172434 - West; Jeffrey Alan ; et al.	2016-06-16
High Breakdown Voltage Microelectronic Device Isolation Structure with Improved Reliability App 20160163785 - West; Jeffrey Alan ; et al.	2016-06-09
Methods and Apparatus for High Voltage Integrated Circuit Capacitors App 20160133690 - West; Jeffrey Alan ; et al.	2016-05-12
Scribe Seals And Methods Of Making App 20160133580 - Bonifield; Thomas D. ; et al.	2016-05-12
High breakdown voltage microelectronic device isolation structure with improved reliability Grant 9,299,697 - West , et al. March 29, 2	2016-03-29
High Breakdown Voltage Microelectronic Device Isolation Structure With Improved Reliability App 20150333055 - West; Jeffrey Alan ; et al.	2015-11-19
Crack Deflector Structure For Improving Semiconductor Device Robustness Against Saw-induced Damage App 20150061081 - WEST; Jeffrey Alan ; et al.	2015-03-05
Crack deflector structure for improving semiconductor device robustness against saw-induced damage Grant 8,912,076 - West , et al. December 16, 2	2014-12-16
IC device having low resistance TSV comprising ground connection Grant 8,436,475 - Dunne , et al. May 7, 2	2013-05-07
IC device having low resistance TSV comprising ground connection Grant 8,431,481 - Dunne , et al. April 30, 2	2013-04-30
IC Device Having Low Resistance TSV Comprising Ground Connection App 20120202321 - Dunne; Rajiv ; et al.	2012-08-09
IC Device Having Low Resistance TSV Comprising Ground Connection App 20120193814 - Dunne; Rajiv ; et al.	2012-08-02
IC device having low resistance TSV comprising ground connection Grant 8,178,976 - Dunne , et al. May 15, 2	2012-05-15
Packaged electronic devices with face-up die having TSV connection to leads and die pad Grant 8,154,134 - Bonifield , et al. April 10, 2	2012-04-10
Mask overhang reduction or elimination after substrate etch Grant 8,043,973 - Goodlin , et al. October 25, 2	2011-10-25
Scribe seal connection Grant 7,968,974 - Summerfelt , et al. June 28, 2	2011-06-28
TSVS Having Chemically Exposed TSV Tips for Integrated Circuit Devices App 20110018107 - Bonifield; Thomas D. ; et al.	2011-01-27
TSVS having chemically exposed TSV tips for integrated circuit devices Grant 7,833,895 - Bonifield , et al. November 16, 2	2010-11-16
Crack Deflector Structure for Improving Semiconductor Device Robustness Against Saw-Induced Damage App 20100109128 - WEST; Jeffrey Alan ; et al.	2010-05-06
Scribe Seal Connection App 20090321889 - Summerfelt; Scott R. ; et al.	2009-12-31
Mask Overhang Reduction Or Elimination After Substrate Etch App 20090289324 - GOODLIN; BRIAN E. ; et al.	2009-11-26
Tsvs Having Chemically Exposed Tsv Tips For Integrated Circuit Devices App 20090278238 - BONIFIELD; THOMAS D. ; et al.	2009-11-12
Ic Device Having Low Resistance Tsv Comprising Ground Connection App 20090278244 - DUNNE; RAJIV ; et al.	2009-11-12
Packaged Electronic Devices With Face-up Die Having Tsv Connection To Leads And Die Pad App 20090278245 - BONIFIELD; THOMAS D. ; et al.	2009-11-12
Nickel alloy silicide including indium and a method of manufacture therefor Grant 7,511,350 - Chen , et al. March 31, 2	2009-03-31
P-doped Region With Improved Abruptness App 20080308904 - Chidambaram; P. R. ; et al.	2008-12-18
Nickel Alloy Silicide Including Indium and a Method of Manufacture Therefor App 20080128837 - Chen; Peijun J. ; et al.	2008-06-05
Nickel silicide including indium and a method of manufacture therefor Grant 7,355,255 - Chen , et al. April 8, 2	2008-04-08
Nickel alloy silicide including indium and a method of manufacture therefor Grant 7,344,985 - Chen , et al. March 18, 2	2008-03-18
Nickel silicide including indium and a method of manufacture therefor App 20070141840 - Chen; Peijun J. ; et al.	2007-06-21
Nickel silicide including indium and a method of manufacture therefor Grant 7,211,516 - Chen , et al. May 1, 2	2007-05-01
Metal silicide induced lateral excessive encroachment reduction by silicon <110> channel stuffing Grant 7,199,032 - Yue , et al. April 3, 2	2007-04-03
Nickel Alloy Silicide Including Indium And A Method Of Manufacture Therefor App 20070049022 - Chen; Peijun J. ; et al.	2007-03-01
Nickel silicide including indium and a method of manufacture therefor App 20060223295 - Chen; Peijun J. ; et al.	2006-10-05
Method for manufacturing a semiconductor device having silicided regions App 20060024882 - Lu; Jiong-Ping ; et al.	2006-02-02
Method for reducing metal silicide excessive encroachment defects in the manufacture of a semiconductor device having silicided source/drain regions App 20060024938 - Yue; Duofeng ; et al.	2006-02-02
Metal silicide induced lateral excessive encroachment reduction by silicon <110> channel stuffing App 20060024935 - Yue; Duofeng ; et al.	2006-02-02
Method for fabricating a multi-level integrated circuit having scatterometry test structures stacked over same footprint area Grant 6,967,349 - Bonifield , et al. November 22, 2	2005-11-22
Scatterometry test structures stacked over same footprint area App 20040058460 - Bonifield, Thomas D. ; et al.	2004-03-25
Method of preventing seam defects in isolated lines Grant 6,709,974 - Permana , et al. March 23, 2	2004-03-23
Method of preventing seam defects in isolated lines App 20030199150 - Permana, David ; et al.	2003-10-23
Stacked vias and method App 20020086519 - Houston, Theodore W. ; et al.	2002-07-04
Metallization process for a semiconductor device Grant 5,444,018 - Yost , et al. August 22, 1	1995-08-22
Planarized selective tungsten metallization system Grant 5,055,423 - Smith , et al. October 8, 1	1991-10-08
Isolation substrate ring for plasma reactor Grant 4,891,087 - Davis , et al. January 2, 1	1990-01-02
Contact etch method Grant 4,758,305 - Bonifield , et al. July 19, 1	1988-07-19
Plasma reactor with reduced chamber wall deposition Grant 4,513,021 - Purdes , et al. April 23, 1	1985-04-23
Plasma reactor sidewall shield Grant 4,512,283 - Bonifield , et al. April 23, 1	1985-04-23