loadpatents
name:-0.0046260356903076
name:-0.011434078216553
name:-0.0003969669342041
Bonges, III; Henry A. Patent Filings

Bonges, III; Henry A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bonges, III; Henry A..The latest application filed is for "system and method to improve chip yeild, reliability and performance".

Company Profile
0.10.3
  • Bonges, III; Henry A. - Milton VT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
System and method to improve chip yield, reliability and performance
Grant 8,635,575 - Bonges, III January 21, 2
2014-01-21
System And Method To Improve Chip Yeild, Reliability And Performance
App 20120227025 - Bonges, III; Henry A.
2012-09-06
System and method to improve chip yield, reliability and performance
Grant 8,185,859 - Bonges, III May 22, 2
2012-05-22
Intersect area based ground rule for semiconductor design
Grant 7,941,780 - Avanessian , et al. May 10, 2
2011-05-10
Intersect Area Based Ground Rule For Semiconductor Design
App 20090265673 - Avanessian; Albrik ;   et al.
2009-10-22
Determining Allowable Antenna Area As Function Of Total Gate Insulator Area For Soi Technology
App 20090158230 - Bonges, III; Henry A. ;   et al.
2009-06-18
System and method to improve chip yield, reliability and performance
Grant 7,299,426 - Bonges, III November 20, 2
2007-11-20
Method of performing latch up check on an integrated circuit design
Grant 7,275,226 - Bonges, III , et al. September 25, 2
2007-09-25
Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage
Grant 7,132,318 - Bonges, III , et al. November 7, 2
2006-11-07
Cloned and original circuit shape merging
Grant 7,120,887 - Bonges, III , et al. October 10, 2
2006-10-10
Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage
Grant 7,067,886 - Bonges, III , et al. June 27, 2
2006-06-27
Module level electronic redundancy
Grant 5,313,424 - Adams , et al. May 17, 1
1994-05-17

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