loadpatents
Patent applications and USPTO patent grants for Bong; Kang Wook.The latest application filed is for "coil component".
Patent | Date |
---|---|
Coil Component App 20220208433 - Bong; Kang Wook ;   et al. | 2022-06-30 |
Coil Component App 20220172878 - Jung; Do Young ;   et al. | 2022-06-02 |
Coil component and manufacturing method thereof Grant 11,217,380 - Bong , et al. January 4, 2 | 2022-01-04 |
Coil component Grant 11,205,539 - Jung , et al. December 21, 2 | 2021-12-21 |
Inductor and method for manufacturing the same Grant 11,145,452 - Kim , et al. October 12, 2 | 2021-10-12 |
Coil electronic component Grant 11,139,108 - Bong , et al. October 5, 2 | 2021-10-05 |
Coil component and method for manufacturing the same Grant 11,094,458 - Bong , et al. August 17, 2 | 2021-08-17 |
Inductor Grant 10,861,633 - Kim , et al. December 8, 2 | 2020-12-08 |
Coil component Grant 10,796,840 - Ryu , et al. October 6, 2 | 2020-10-06 |
Thin film-type inductor Grant 10,763,032 - Kim , et al. Sep | 2020-09-01 |
Thin film type inductor Grant 10,741,321 - Kim , et al. A | 2020-08-11 |
Coil component and method of manufacturing same Grant 10,566,130 - Bong , et al. Feb | 2020-02-18 |
Coil component and method of manufacturing same Grant 10,515,754 - Bong , et al. Dec | 2019-12-24 |
Coil Component And Method Of Manufacturing Same App 20190378644 - BONG; Kang Wook ;   et al. | 2019-12-12 |
Coil Electronic Component App 20190362886 - BONG; Kang Wook ;   et al. | 2019-11-28 |
Coil Component And Method Of Manufacturing The Same App 20190326055 - BONG; Kang Wook ;   et al. | 2019-10-24 |
Inductor App 20190259522 - KIM; Jae Hun ;   et al. | 2019-08-22 |
Coil Component And Manufacturing Method Thereof App 20190221356 - BONG; Kang Wook ;   et al. | 2019-07-18 |
Inductor App 20190198234 - JUNG; Ji Hyung ;   et al. | 2019-06-27 |
Coil Component App 20190180905 - RYU; Joung Gul ;   et al. | 2019-06-13 |
Thin Film-type Inductor App 20190013142 - KIM; Boum Seock ;   et al. | 2019-01-10 |
Thin Film Type Inductor App 20190013143 - KIM; Boum Seock ;   et al. | 2019-01-10 |
Coil Component And Method For Manufacturing The Same App 20190006100 - BONG; Kang Wook ;   et al. | 2019-01-03 |
Coil Component App 20180358171 - JUNG; Ji Hyung ;   et al. | 2018-12-13 |
Coil Component And Method Of Manufacturing The Same App 20180350505 - RYU; Joung Gul ;   et al. | 2018-12-06 |
Inductor And Method For Manufacturing The Same App 20180197672 - KIM; Boum Seock ;   et al. | 2018-07-12 |
Printed circuit board and method of manufacturing the same Grant 10,021,785 - Kang , et al. July 10, 2 | 2018-07-10 |
Coil Component And Method Of Manufacturing Same App 20180019051 - BONG; Kang Wook ;   et al. | 2018-01-18 |
Printed circuit board and method of manufacturing the same Grant 9,554,466 - Kang , et al. January 24, 2 | 2017-01-24 |
Printed Circuit Board And Method Of Manufacturing The Same App 20160192491 - KANG; Myung-Sam ;   et al. | 2016-06-30 |
Printed Circuit Board And Method Of Manufacturing The Same App 20160192490 - KANG; Myung-Sam ;   et al. | 2016-06-30 |
Printed Circuit Board And Manufacturing Method Thereof App 20160100485 - JUNG; Hye-Won ;   et al. | 2016-04-07 |
Package Board, Method Of Manufacturing The Same And Stack Type Package Using The Same App 20160021749 - BONG; Kang Wook ;   et al. | 2016-01-21 |
Printed Circuit Board, Method For Maufacturing The Same And Package On Package Having The Same App 20150342046 - KIM; Hye Jin ;   et al. | 2015-11-26 |
Printed Circuit Board And Manufacturing Method Thereof App 20150156883 - Bong; Kang Wook ;   et al. | 2015-06-04 |
Printed Circuit Board, Manufacturing Method Thereof, And Semiconductor Package App 20150156882 - BONG; Kang Wook ;   et al. | 2015-06-04 |
Insulation Material, Printed Circuit Board Using The Same And Method Of Manufacturing The Same App 20150114699 - Ko; Young Gwan ;   et al. | 2015-04-30 |
EMI noise shield board including electromagnetic bandgap structure Grant 8,699,234 - Kim , et al. April 15, 2 | 2014-04-15 |
Electromagnetic bandgap structure and printed circuit board Grant 8,319,572 - Kim , et al. November 27, 2 | 2012-11-27 |
Printed circuit board having electromagnetic bandgap structure Grant 8,314,341 - Kim , et al. November 20, 2 | 2012-11-20 |
Electromagnetic interference noise reduction board using electromagnetic bandgap structure Grant 8,258,408 - Kim , et al. September 4, 2 | 2012-09-04 |
Printed circuit board having electromagnetic bandgap structure Grant 8,242,377 - Jung , et al. August 14, 2 | 2012-08-14 |
Printed circuit board having electromagnetic bandgap structure Grant 8,227,704 - Park , et al. July 24, 2 | 2012-07-24 |
Electromagnetic interference noise reduction board using electromagnetic bandgap structure Grant 8,212,150 - Kim , et al. July 3, 2 | 2012-07-03 |
Electromagnetic bandgap structure and printed circuit board Grant 8,076,998 - Bong , et al. December 13, 2 | 2011-12-13 |
Emi Noise Shield Board Including Electromagnetic Bandgap Structure App 20110299264 - KIM; Han ;   et al. | 2011-12-08 |
Electromagnetic interference noise reduction board using electromagnetic bandgap structure App 20110067915 - Kim; Han ;   et al. | 2011-03-24 |
Printed circuit board having electromagnetic bandgap structure App 20110067917 - Park; Dae-Hyun ;   et al. | 2011-03-24 |
Printed circuit board having electromagnetic bandgap structure App 20110067916 - Kim; Han ;   et al. | 2011-03-24 |
Electromagnetic interference noise reduction board using electromagnetic bandgap structure App 20110069470 - Bong; Kang-Wook ;   et al. | 2011-03-24 |
Printed circuit board having electromagnetic bandgap structure App 20110067914 - Jung; Hyo-Jic ;   et al. | 2011-03-24 |
Electromagnetic interference noise reduction board using electromagnetic bandgap structure App 20110031007 - Kim; Han ;   et al. | 2011-02-10 |
Electromagnetic Bandgap Structure And Printed Circuit Board App 20100134212 - KIM; Han ;   et al. | 2010-06-03 |
Electromagnetic Bandgap Structure And Printed Circuit Board App 20100132996 - Han; Mi-Ja ;   et al. | 2010-06-03 |
Electromagnetic Bandgap Structure And Printed Circuit Board App 20100127790 - Bong; Kang-Wook ;   et al. | 2010-05-27 |
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