Bond; Robert H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bond; Robert H..The latest application filed is for "electronic device including finger sensor and related methods".

Company Profile

0.17.3

Bond; Robert H. - Plano TX US
Bond; Robert H. - Denton TX
Bond; Robert H. - Carrollton TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic device including finger sensor and related methods Grant 8,836,478 - Bond , et al. September 16, 2	2014-09-16
Finger sensor including capacitive lens and associated methods Grant 8,803,258 - Gozzini , et al. August 12, 2	2014-08-12
Electronic Device Including Finger Sensor And Related Methods App 20130076486 - Bond; Robert H. ; et al.	2013-03-28
Finger Sensor Including Capacitive Lens And Associated Methods App 20110254108 - Gozzini; Giovanni ; et al.	2011-10-20
Material transport method Grant 6,889,813 - Trammell , et al. May 10, 2	2005-05-10
Ball grid array integrated circuit package with high thermal conductivity Grant 5,991,156 - Bond , et al. November 23, 1	1999-11-23
Ball grid array integrated circuit package with high thermal conductivity Grant 5,693,572 - Bond , et al. December 2, 1	1997-12-02
Ball grid array package with detachable module Grant 5,642,265 - Bond , et al. June 24, 1	1997-06-24
Ball-grid-array integrated circuit package with solder-connected thermal conductor Grant 5,642,261 - Bond , et al. June 24, 1	1997-06-24
Method for holding a strip of conductive lead frames Grant 5,182,851 - Bond , et al. February 2, 1	1993-02-02
Manipulation and handling of integrated circuit dice Grant 4,915,565 - Bond , et al. April 10, 1	1990-04-10
Chip selection in automatic assembly of integrated circuit Grant 4,759,675 - Bond , et al. July 26, 1	1988-07-26
Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging Grant 4,743,956 - Olla , et al. May 10, 1	1988-05-10
Integrated-circuit leadframe adapted for a simultaneous bonding operation Grant 4,722,060 - Quinn , et al. January 26, 1	1988-01-26
Process of forming integrated circuits with contact pads in a standard array Grant 4,685,998 - August 11, 1	1987-08-11
Automatic assembly of integrated circuits Grant 4,627,151 - Mulholland , et al. December 9, 1	1986-12-09
Manipulation and handling of integrated circuit dice Grant 4,626,167 - Bond , et al. December 2, 1	1986-12-02

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