Bollmann; Dieter

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bollmann; Dieter.The latest application filed is for "patterned layer compound".

Company Profile

0.5.4

Bollmann; Dieter - Munich DE
BOLLMANN; Dieter - Muenchen DE
Bollmann; Dieter - Munchen DE
Bollmann; Dieter - Reinheim DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Carrier wafer, method for holding a flexible substrate and method for the manufacture of a carrier wafer Grant 9,978,626 - Kutter , et al. May 22, 2	2018-05-22
Patterned Layer Compound App 20180035548 - LANDESBERGER; Christof ; et al.	2018-02-01
Carrier Wafer, Method For Holding A Flexible Substrate And Method For The Manufacture Of A Carrier Wafer App 20160035611 - Kutter; Christoph ; et al.	2016-02-04
Bipolar carrier wafer and mobile bipolar electrostatic wafer arrangement Grant 7,667,945 - Wieland , et al. February 23, 2	2010-02-23
Bipolar Carrier Wafer and Mobile Bipolar Electrostatic Wafer Arrangement App 20080237819 - Wieland; Robert ; et al.	2008-10-02
Mobile electrostatic carrier wafer with electrically isolated charge storage App 20080123241 - Bollmann; Dieter	2008-05-29
Method of producing a micro-electromechanical element Grant 7,273,763 - Neumeier , et al. September 25, 2	2007-09-25
Method of producing calibration structures in semiconductor substrates Grant 6,451,668 - Neumeier , et al. September 17, 2	2002-09-17
Ball bearig gears Grant 5,016,487 - Bollmann May 21, 1	1991-05-21

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