loadpatents
name:-0.016667127609253
name:-0.018800020217896
name:-0.0060310363769531
Bolde; Lannie R. Patent Filings

Bolde; Lannie R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bolde; Lannie R..The latest application filed is for "hybrid cable assembly".

Company Profile
5.19.12
  • Bolde; Lannie R. - Ulster Park NY
  • Bolde; Lannie R. - New Paltz NY
  • Bolde; Lannie R - New Paltz NY
  • Bolde, Lannie R. - New Palte NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Printed circuit card assembly connectable to a server chassis
Grant 10,973,157 - Elsasser , et al. April 6, 2
2021-04-06
Hybrid Cable Assembly
App 20210090762 - BOLDE; Lannie R. ;   et al.
2021-03-25
Hybrid cable assembly having shielded and unshielded portions
Grant 10,930,411 - Bolde , et al. February 23, 2
2021-02-23
Slide Loaded Pcie Card Assembly With Emi Shielding
App 20200137933 - ELSASSER; Ryan ;   et al.
2020-04-30
Hybrid Cable Assembly
App 20200118711 - BOLDE; Lannie R. ;   et al.
2020-04-16
Lift mechanism
Grant 9,108,828 - Bolde August 18, 2
2015-08-18
Lift Mechanism
App 20140199141 - Bolde; Lannie R.
2014-07-17
Method and apparatus for removing known good die
Grant 7,806,312 - Bolde , et al. October 5, 2
2010-10-05
Feed devices and methods for injection molded solder systems
Grant 7,296,725 - Gruber , et al. November 20, 2
2007-11-20
Method And Apparatus For Removing Known Good Die
App 20070057024 - Bolde; Lannie R. ;   et al.
2007-03-15
Method and apparatus for removing known good die
Grant 7,168,609 - Bolde , et al. January 30, 2
2007-01-30
Feed devices and methods for injection molded solder systems
Grant 7,131,565 - Gruber , et al. November 7, 2
2006-11-07
Feed Devices And Methods For Injection Molded Solder Systems
App 20060231591 - Gruber; Peter M. ;   et al.
2006-10-19
Die removal method and apparatus
Grant 6,942,137 - Bolde , et al. September 13, 2
2005-09-13
Apparatus for removing attached die
Grant 6,915,563 - Bolde , et al. July 12, 2
2005-07-12
Feed devices and methods for injection molded solder systems
App 20050109823 - Gruber, Peter ;   et al.
2005-05-26
Method and device for cooling/heating die during burn in
Grant 6,888,363 - Bolde , et al. May 3, 2
2005-05-03
Known Good Die Removal Method And Apparatus
App 20050082352 - Bolde, Lannie R. ;   et al.
2005-04-21
Flexible Die Removal Device
App 20040261261 - Bolde, Lannie R. ;   et al.
2004-12-30
Known good die removal method and apparatus
Grant 6,811,072 - Bolde November 2, 2
2004-11-02
Method for loading solder balls into a mold
Grant 6,745,450 - Bolde June 8, 2
2004-06-08
Method and apparatus for removing known good die
App 20040041011 - Bolde, Lannie R. ;   et al.
2004-03-04
Known good die removal method and apparatus
App 20020088846 - Bolde, Lannie R.
2002-07-11
Method and apparatus for removing known good die
Grant 6,360,940 - Bolde , et al. March 26, 2
2002-03-26
Low temperature solder column attach by injection molded solder and structure formed
App 20020023945 - Gruber, Peter A. ;   et al.
2002-02-28
Plastic solder array using injection molded solder
Grant 6,153,505 - Bolde , et al. November 28, 2
2000-11-28
Cast metal seal for semiconductor substrates
Grant 5,982,038 - Toy , et al. November 9, 1
1999-11-09
Fixture and method for securing electronic modules during wet processing
Grant 5,913,985 - Lei , et al. June 22, 1
1999-06-22
Cast metal seal for semiconductor substrates and process thereof
Grant 5,821,161 - Covell, II , et al. October 13, 1
1998-10-13
Apparatus and a method for alignment verification having an opaque work piece between two artwork masters
Grant 5,170,058 - Berasi , et al. December 8, 1
1992-12-08
Compact photo resist dryer
Grant 5,167,078 - Bolde , et al. December 1, 1
1992-12-01

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