loadpatents
Patent applications and USPTO patent grants for Bolde; Lannie R..The latest application filed is for "hybrid cable assembly".
Patent | Date |
---|---|
Printed circuit card assembly connectable to a server chassis Grant 10,973,157 - Elsasser , et al. April 6, 2 | 2021-04-06 |
Hybrid Cable Assembly App 20210090762 - BOLDE; Lannie R. ;   et al. | 2021-03-25 |
Hybrid cable assembly having shielded and unshielded portions Grant 10,930,411 - Bolde , et al. February 23, 2 | 2021-02-23 |
Slide Loaded Pcie Card Assembly With Emi Shielding App 20200137933 - ELSASSER; Ryan ;   et al. | 2020-04-30 |
Hybrid Cable Assembly App 20200118711 - BOLDE; Lannie R. ;   et al. | 2020-04-16 |
Lift mechanism Grant 9,108,828 - Bolde August 18, 2 | 2015-08-18 |
Lift Mechanism App 20140199141 - Bolde; Lannie R. | 2014-07-17 |
Method and apparatus for removing known good die Grant 7,806,312 - Bolde , et al. October 5, 2 | 2010-10-05 |
Feed devices and methods for injection molded solder systems Grant 7,296,725 - Gruber , et al. November 20, 2 | 2007-11-20 |
Method And Apparatus For Removing Known Good Die App 20070057024 - Bolde; Lannie R. ;   et al. | 2007-03-15 |
Method and apparatus for removing known good die Grant 7,168,609 - Bolde , et al. January 30, 2 | 2007-01-30 |
Feed devices and methods for injection molded solder systems Grant 7,131,565 - Gruber , et al. November 7, 2 | 2006-11-07 |
Feed Devices And Methods For Injection Molded Solder Systems App 20060231591 - Gruber; Peter M. ;   et al. | 2006-10-19 |
Die removal method and apparatus Grant 6,942,137 - Bolde , et al. September 13, 2 | 2005-09-13 |
Apparatus for removing attached die Grant 6,915,563 - Bolde , et al. July 12, 2 | 2005-07-12 |
Feed devices and methods for injection molded solder systems App 20050109823 - Gruber, Peter ;   et al. | 2005-05-26 |
Method and device for cooling/heating die during burn in Grant 6,888,363 - Bolde , et al. May 3, 2 | 2005-05-03 |
Known Good Die Removal Method And Apparatus App 20050082352 - Bolde, Lannie R. ;   et al. | 2005-04-21 |
Flexible Die Removal Device App 20040261261 - Bolde, Lannie R. ;   et al. | 2004-12-30 |
Known good die removal method and apparatus Grant 6,811,072 - Bolde November 2, 2 | 2004-11-02 |
Method for loading solder balls into a mold Grant 6,745,450 - Bolde June 8, 2 | 2004-06-08 |
Method and apparatus for removing known good die App 20040041011 - Bolde, Lannie R. ;   et al. | 2004-03-04 |
Known good die removal method and apparatus App 20020088846 - Bolde, Lannie R. | 2002-07-11 |
Method and apparatus for removing known good die Grant 6,360,940 - Bolde , et al. March 26, 2 | 2002-03-26 |
Low temperature solder column attach by injection molded solder and structure formed App 20020023945 - Gruber, Peter A. ;   et al. | 2002-02-28 |
Plastic solder array using injection molded solder Grant 6,153,505 - Bolde , et al. November 28, 2 | 2000-11-28 |
Cast metal seal for semiconductor substrates Grant 5,982,038 - Toy , et al. November 9, 1 | 1999-11-09 |
Fixture and method for securing electronic modules during wet processing Grant 5,913,985 - Lei , et al. June 22, 1 | 1999-06-22 |
Cast metal seal for semiconductor substrates and process thereof Grant 5,821,161 - Covell, II , et al. October 13, 1 | 1998-10-13 |
Apparatus and a method for alignment verification having an opaque work piece between two artwork masters Grant 5,170,058 - Berasi , et al. December 8, 1 | 1992-12-08 |
Compact photo resist dryer Grant 5,167,078 - Bolde , et al. December 1, 1 | 1992-12-01 |
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