Bohlinger; Michael J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bohlinger; Michael J..The latest application filed is for "vertical sensor assembly method".
- Bohlinger; Michael J. - Minnetonka MN US
- Bohlinger; Michael J. - Minetonka MN
| Patent | Date |
|---|---|
| Vertical sensor assembly method Grant 8,703,543 - Wan , et al. April 22, 2 | 2014-04-22 |
| Vertical Sensor Assembly Method App 20110012213 - Wan; Hong ; et al. | 2011-01-20 |
| Low height vertical sensor packaging Grant 7,671,478 - Wathanawasam , et al. March 2, 2 | 2010-03-02 |
| 3d Integrated Compass Package App 20090072823 - Wan; Hong ; et al. | 2009-03-19 |
| Single package design for 3-axis magnetic sensor Grant 7,271,586 - Bohlinger , et al. September 18, 2 | 2007-09-18 |
| Magnetic field sensing device Grant 7,202,771 - Bohlinger April 10, 2 | 2007-04-10 |
| Low height vertical sensor packaging App 20070052077 - Wathanawasam; Lakshman S. ; et al. | 2007-03-08 |
| Vertical die chip-on-board Grant 7,095,226 - Wan , et al. August 22, 2 | 2006-08-22 |
| Magnetic field sensing device App 20060152332 - Bohlinger; Michael J. | 2006-07-13 |
| Magnetic field sensing device Grant 7,034,651 - Bohlinger April 25, 2 | 2006-04-25 |
| Single package design for 3-axis magnetic sensor App 20050122101 - Bohlinger, Michael J. ; et al. | 2005-06-09 |
| Vertical die chip-on-board App 20050122100 - Wan, Hong ; et al. | 2005-06-09 |
| Magnetic field sensing device App 20030141957 - Bohlinger, Michael J. | 2003-07-31 |
| Magnetic field sensing device Grant 6,529,114 - Bohlinger , et al. March 4, 2 | 2003-03-04 |
| Magnetometer Package App 20020140422 - Bodin, Joel J. ; et al. | 2002-10-03 |
| Method of fabricating a magnetoresistive sensor Grant 5,820,924 - Witcraft , et al. October 13, 1 | 1998-10-13 |
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