Boettcher; Mathias
Patent Applications and Registrations
Patent applications and USPTO patent grants for Boettcher; Mathias.The latest application filed is for "electronic system with integrated circuit device and passive component".
- Boettcher; Mathias - Dresden DE
| Patent | Date |
|---|---|
| Electronic System With Integrated Circuit Device And Passive Component App 20080225503 - Wollmann; Markus ; et al. | 2008-09-18 |
| Solder bump structure and a method of forming the same Grant 6,639,314 - Boettcher , et al. October 28, 2 | 2003-10-28 |
| Solder bump structure and a method of forming the same App 20030052415 - Boettcher, Mathias ; et al. | 2003-03-20 |
| Test cell structure for estimating electrical characteristics of closely-spaced bond pads formed on a substrate App 20020075020 - Boettcher, Mathias ; et al. | 2002-06-20 |
| Decoupling capacitor configuration for integrated circuit chip Grant 6,191,479 - Herrell , et al. February 20, 2 | 2001-02-20 |
| High speed bump plating/forming Grant 6,162,718 - Boettcher December 19, 2 | 2000-12-19 |
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