Bock; Kim Lee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bock; Kim Lee.The latest application filed is for "semiconductor device with top die positioned to reduce die cracking".

Company Profile

2.7.5

Bock; Kim Lee - Shanghai CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with top die positioned to reduce die cracking Grant 11,177,241 - Yan , et al. November 16, 2	2021-11-16
Semiconductor Device With Top Die Positioned To Reduce Die Cracking App 20200381401 - Yan; Junrong ; et al.	2020-12-03
Semiconductor device including corner recess Grant 10,418,334 - Zhang , et al. Sept	2019-09-17
Semiconductor device including conductive bump interconnections Grant 10,283,485 - Yan , et al.	2019-05-07
Semiconductor Device Including Conductive Bump Interconnections App 20180337161 - Yan; Junrong ; et al.	2018-11-22
Semiconductor device including die bond pads at a die edge Grant 10,128,218 - Yan , et al. November 13, 2	2018-11-13
Semiconductor Device Including Die Bond Pads At A Die Edge App 20180175006 - Yan; Junrong ; et al.	2018-06-21
Semiconductor Device Including Corner Recess App 20180174983 - Zhang; Hang ; et al.	2018-06-21
Semiconductor device including independent film layer for embedding and/or spacing semiconductor die Grant 9,773,766 - Ye , et al. September 26, 2	2017-09-26
Semiconductor Device Including Independent Film Layer For Embedding And/or Spacing Semiconductor Die App 20150221624 - Ye; Ning ; et al.	2015-08-06
Non-uniform vacuum profile die attach tip Grant 9,038,264 - Rai , et al. May 26, 2	2015-05-26

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