Bloomsburgh; John Gardner
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bloomsburgh; John Gardner.The latest application filed is for "multi-die mems package".
- Bloomsburgh; John Gardner - Oakland CA
- Bloomsburgh; John Gardner - Cambridge MA
| Patent | Date |
|---|---|
| Sealed packaging for microelectromechanical systems Grant 9,856,132 - Bryzek , et al. January 2, 2 | 2018-01-02 |
| Multi-die MEMS package Grant 9,586,813 - Bryzek , et al. March 7, 2 | 2017-03-07 |
| Flexure bearing to reduce quadrature for resonating micromachined devices Grant 9,352,961 - Acar , et al. May 31, 2 | 2016-05-31 |
| Multi-die Mems Package App 20150321904 - Bryzek; Janusz ; et al. | 2015-11-12 |
| Packaging to reduce stress on microelectromechanical systems Grant 9,156,673 - Bryzek , et al. October 13, 2 | 2015-10-13 |
| Multi-die MEMS package Grant 9,095,072 - Bryzek , et al. July 28, 2 | 2015-07-28 |
| MEMS multi-axis accelerometer electrode structure Grant 9,062,972 - Acar , et al. June 23, 2 | 2015-06-23 |
| Through silicon via with reduced shunt capacitance Grant 9,006,846 - Bryzek , et al. April 14, 2 | 2015-04-14 |
| Packaging To Reduce Stress On Microelectromechanical Systems App 20130341737 - Bryzek; Janusz ; et al. | 2013-12-26 |
| Flexure Bearing To Reduce Quadrature For Resonating Micromachined Devices App 20130298671 - Acar; Cenk ; et al. | 2013-11-14 |
| Through Silcon Via With Reduced Shunt Capacitance App 20130277773 - Bryzek; Janusz ; et al. | 2013-10-24 |
| Sealed Packaging For Microelectromechanical Systems App 20130270660 - Bryzek; Janusz ; et al. | 2013-10-17 |
| Multi-die Mems Package App 20130250532 - Bryzek; Janusz ; et al. | 2013-09-26 |
| Mems Multi-axis Accelerometer Electrode Structure App 20130192369 - Acar; Cenk ; et al. | 2013-08-01 |
| Multi-axis sensor Grant 8,006,557 - Yin , et al. August 30, 2 | 2011-08-30 |
| Multi-axis Sensor App 20080282801 - Yin; Luzhong ; et al. | 2008-11-20 |
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