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Patent applications and USPTO patent grants for Blondeau; Beryl.The latest application filed is for "surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials".
Patent | Date |
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Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials Grant 6,991,944 - Rayssac , et al. January 31, 2 | 2006-01-31 |
Method for improving the quality of heterostructure App 20050130393 - Blondeau, Beryl ;   et al. | 2005-06-16 |
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials App 20050130429 - Rayssac, Olivier ;   et al. | 2005-06-16 |
Preparation method for protecting the back surface of a wafer and back surface protected wafer App 20040241461 - Maurice, Thibaut ;   et al. | 2004-12-02 |
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