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Patent applications and USPTO patent grants for Blish; Richard C..The latest application filed is for "soft error resistant circuitry".
Patent | Date |
---|---|
Soft error resistant circuitry Grant 8,946,663 - Blish , et al. February 3, 2 | 2015-02-03 |
Copper interconnects with improved electromigration lifetime Grant 8,723,321 - Woo , et al. May 13, 2 | 2014-05-13 |
Soft Error Resistant Circuitry App 20130306885 - Blish; Richard C. ;   et al. | 2013-11-21 |
Method Of Forming Vias In A Semiconductor Device App 20080182407 - Zhai; Jun ;   et al. | 2008-07-31 |
Methods and systems for memory devices App 20080175054 - Hancock; Bryan William ;   et al. | 2008-07-24 |
Method and semiconductor structure for reliability characterization App 20080102637 - Zhai; Jun ;   et al. | 2008-05-01 |
Copper interconnects with improved electromigration lifetime App 20070284748 - Woo; Christy ;   et al. | 2007-12-13 |
Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products Grant 6,548,881 - Blish , et al. April 15, 2 | 2003-04-15 |
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