Patent | Date |
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Thermal interface material and semiconductor component including the thermal interface material Grant 8,384,210 - Blish, II , et al. February 26, 2 | 2013-02-26 |
Methods and systems for recovering data in a nonvolatile memory array Grant 7,561,465 - Hancock , et al. July 14, 2 | 2009-07-14 |
Counterflow Microchannel Cooler For Integrated Circuits App 20080298017 - Blish, II; Richard C. | 2008-12-04 |
Counterflow microchannel cooler for integrated circuits Grant 7,460,369 - Blish, II December 2, 2 | 2008-12-02 |
Integrated circuit package and method Grant 7,253,504 - Zhai , et al. August 7, 2 | 2007-08-07 |
Prevention of counterfeit markings on semiconductor devices Grant 7,157,131 - Blish, II , et al. January 2, 2 | 2007-01-02 |
Structure for minimizing hot spots in SOI device Grant 6,844,573 - Blish, II January 18, 2 | 2005-01-18 |
Neutron detecting device Grant 6,841,841 - Blish, II , et al. January 11, 2 | 2005-01-11 |
Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability Grant 6,803,653 - Likins , et al. October 12, 2 | 2004-10-12 |
Method and system for removing conductive lines during deprocessing Grant 6,768,198 - Blish, II , et al. July 27, 2 | 2004-07-27 |
Prevention of parametic or functional changes to silicon semiconductor device properties during x-ray inspection Grant 6,751,294 - Blish II , et al. June 15, 2 | 2004-06-15 |
High pressure water stream to separate a multi-layer integrated circuit device and package Grant 6,119,325 - Black , et al. September 19, 2 | 2000-09-19 |
Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor Grant 6,049,465 - Blish, II , et al. April 11, 2 | 2000-04-11 |
Electrophoretic coating methodology to improve internal package delamination and wire bond reliability Grant 6,046,507 - Hatchard , et al. April 4, 2 | 2000-04-04 |
Method of making flip chip packages Grant 6,043,429 - Blish, II , et al. March 28, 2 | 2000-03-28 |
Via configuration with decreased pitch and/or increased routing space Grant 6,037,547 - Blish, II March 14, 2 | 2000-03-14 |
Distributed voltage converter apparatus and method for high power microprocessor with array connections Grant 5,914,873 - Blish, II June 22, 1 | 1999-06-22 |
Apparatus and method to improve electromigration performance by use of amorphous barrier layer Grant 5,882,738 - Blish, II , et al. March 16, 1 | 1999-03-16 |
Quad flat package heat slug composition Grant 5,489,801 - Blish, II February 6, 1 | 1996-02-06 |
Quad flat package heat slug composition Grant 5,397,746 - Blish, II March 14, 1 | 1995-03-14 |
Integrated circuit package for surface mount technology Grant 4,870,224 - Smith , et al. September 26, 1 | 1989-09-26 |
Selective plasma vapor etching process Grant 4,213,818 - Lemons , et al. July 22, 1 | 1980-07-22 |