loadpatents
name:-0.00148606300354
name:-0.021525859832764
name:-0.00039291381835938
Blish, II; Richard C. Patent Filings

Blish, II; Richard C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Blish, II; Richard C..The latest application filed is for "counterflow microchannel cooler for integrated circuits".

Company Profile
0.22.1
  • Blish, II; Richard C. - Saratoga CA US
  • Blish, II; Richard C. - Scottsdale AZ
  • Blish, II; Richard C. - Los Gatos CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thermal interface material and semiconductor component including the thermal interface material
Grant 8,384,210 - Blish, II , et al. February 26, 2
2013-02-26
Methods and systems for recovering data in a nonvolatile memory array
Grant 7,561,465 - Hancock , et al. July 14, 2
2009-07-14
Counterflow Microchannel Cooler For Integrated Circuits
App 20080298017 - Blish, II; Richard C.
2008-12-04
Counterflow microchannel cooler for integrated circuits
Grant 7,460,369 - Blish, II December 2, 2
2008-12-02
Integrated circuit package and method
Grant 7,253,504 - Zhai , et al. August 7, 2
2007-08-07
Prevention of counterfeit markings on semiconductor devices
Grant 7,157,131 - Blish, II , et al. January 2, 2
2007-01-02
Structure for minimizing hot spots in SOI device
Grant 6,844,573 - Blish, II January 18, 2
2005-01-18
Neutron detecting device
Grant 6,841,841 - Blish, II , et al. January 11, 2
2005-01-11
Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability
Grant 6,803,653 - Likins , et al. October 12, 2
2004-10-12
Method and system for removing conductive lines during deprocessing
Grant 6,768,198 - Blish, II , et al. July 27, 2
2004-07-27
Prevention of parametic or functional changes to silicon semiconductor device properties during x-ray inspection
Grant 6,751,294 - Blish II , et al. June 15, 2
2004-06-15
High pressure water stream to separate a multi-layer integrated circuit device and package
Grant 6,119,325 - Black , et al. September 19, 2
2000-09-19
Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor
Grant 6,049,465 - Blish, II , et al. April 11, 2
2000-04-11
Electrophoretic coating methodology to improve internal package delamination and wire bond reliability
Grant 6,046,507 - Hatchard , et al. April 4, 2
2000-04-04
Method of making flip chip packages
Grant 6,043,429 - Blish, II , et al. March 28, 2
2000-03-28
Via configuration with decreased pitch and/or increased routing space
Grant 6,037,547 - Blish, II March 14, 2
2000-03-14
Distributed voltage converter apparatus and method for high power microprocessor with array connections
Grant 5,914,873 - Blish, II June 22, 1
1999-06-22
Apparatus and method to improve electromigration performance by use of amorphous barrier layer
Grant 5,882,738 - Blish, II , et al. March 16, 1
1999-03-16
Quad flat package heat slug composition
Grant 5,489,801 - Blish, II February 6, 1
1996-02-06
Quad flat package heat slug composition
Grant 5,397,746 - Blish, II March 14, 1
1995-03-14
Integrated circuit package for surface mount technology
Grant 4,870,224 - Smith , et al. September 26, 1
1989-09-26
Selective plasma vapor etching process
Grant 4,213,818 - Lemons , et al. July 22, 1
1980-07-22

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