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Patent applications and USPTO patent grants for Blietz; Markus.The latest application filed is for "soi wafer and method for producing it".
Patent | Date |
---|---|
SOI wafer and method for producing it Grant 8,323,403 - Graef , et al. December 4, 2 | 2012-12-04 |
Layered semiconductor wafer with low warp and bow, and process for producing it Grant 7,820,549 - Blietz , et al. October 26, 2 | 2010-10-26 |
SOI wafer and method for producing it Grant 7,394,129 - Graf , et al. July 1, 2 | 2008-07-01 |
Soi Wafer And Method For Producing It App 20080153259 - Graef; Dieter ;   et al. | 2008-06-26 |
Layered Semiconductor Wafer With Low Warp And Bow, And Process For Producing It App 20080122043 - Blietz; Markus ;   et al. | 2008-05-29 |
Layered semiconductor wafer with low warp and bow, and process for producing it App 20060046431 - Blietz; Markus ;   et al. | 2006-03-02 |
SOI wafer and method for producing it App 20050245048 - Graf, Dieter ;   et al. | 2005-11-03 |
Semiconductor wafer with a thin epitaxial silicon layer, and production process App 20040144977 - Schauer, Reinhard ;   et al. | 2004-07-29 |
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