loadpatents
Patent applications and USPTO patent grants for Blackwell, Jr.; Richard J.The latest application filed is for "stacked modular architecture high-resolution thermal chip camera".
Patent | Date |
---|---|
Stacked modular architecture high-resolution thermal chip camera Grant 9,787,914 - Sengupta , et al. October 10, 2 | 2017-10-10 |
Stacked Modular Architecture High-resolution Thermal Chip Camera App 20170070685 - Sengupta; Louise C. ;   et al. | 2017-03-09 |
3D stacked uncooled IR sensor device and method Grant 8,975,583 - Tinkler , et al. March 10, 2 | 2015-03-10 |
Wafer-level intrapixel getter reflector whole die encapsulation device and method Grant 8,664,602 - Blackwell, Jr. March 4, 2 | 2014-03-04 |
3d Stacked Uncooled Ir Sensor Device And Method App 20130235210 - Tinkler; Rosanne H. ;   et al. | 2013-09-12 |
Wafer-level Intrapixel Getter Reflector Whole Die Encapsulation Device And Method App 20130153766 - Blackwell, JR.; Richard J. | 2013-06-20 |
Post-supported microbolometer pixel Grant 8,426,818 - Blackwell, Jr. , et al. April 23, 2 | 2013-04-23 |
On-wafer butted microbolometer imaging array Grant 8,294,099 - Blackwell, Jr. October 23, 2 | 2012-10-23 |
On-wafer Butted Microbolometer Imaging Array App 20100258725 - Blackwell, JR.; Richard J. | 2010-10-14 |
Post-supported Microbolometer Pixel App 20090250612 - Blackwell, JR.; Richard J. ;   et al. | 2009-10-08 |
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