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Subtractively patterned interconnect structures for integrated circuits Grant 11,444,024 - Lin , et al. September 13, 2 | 2022-09-13 |
Advanced Lithography And Self-assembled Devices App 20220262722 - SCHENKER; Richard E. ;   et al. | 2022-08-18 |
Activation of protected cross-linking catalysts during formation of dielectric materials Grant 11,406,972 - Blackwell , et al. August 9, 2 | 2022-08-09 |
Ligand-capped Main Group Nanoparticles As High Absorption Extreme Ultraviolet Lithography Resists App 20220229364 - KRYSAK; Marie ;   et al. | 2022-07-21 |
Two-stage Bake Photoresist With Releasable Quencher App 20220216065 - BRISTOL; Robert L. ;   et al. | 2022-07-07 |
Advanced lithography and self-assembled devices Grant 11,373,950 - Schenker , et al. June 28, 2 | 2022-06-28 |
Interconnect Structures With Area Selective Adhesion Or Barrier Materials For Low Resistance Vias In Integrated Circuits App 20220139772 - Jezewski; Christoper ;   et al. | 2022-05-05 |
Subtractively Patterned Interconnect Structures For Integrated Circuits App 20220139823 - Lin; Kevin ;   et al. | 2022-05-05 |
Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resists Grant 11,320,734 - Krysak , et al. May 3, 2 | 2022-05-03 |
Differential Hardmasks For Modulation Of Electrobucket Sensitivity App 20220130719 - LIN; Kevin L. ;   et al. | 2022-04-28 |
Two-stage bake photoresist with releasable quencher Grant 11,315,798 - Bristol , et al. April 26, 2 | 2022-04-26 |
Bottom-up Fill Dielectric Materials For Semiconductor Structure Fabrication And Their Methods Of Fabrication App 20220102207 - GSTREIN; Florian ;   et al. | 2022-03-31 |
Differential hardmasks for modulation of electrobucket sensitivity Grant 11,251,072 - Lin , et al. February 15, 2 | 2022-02-15 |
Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication Grant 11,232,980 - Gstrein , et al. January 25, 2 | 2022-01-25 |
Carbon-based dielectric materials for semiconductor structure fabrication and the resulting structures Grant 11,217,455 - Blackwell , et al. January 4, 2 | 2022-01-04 |
Selective etching and controlled atomic layer etching of transition metal oxide films for device fabrication Grant 11,217,456 - Blackwell , et al. January 4, 2 | 2022-01-04 |
Lined Photobucket Structure For Back End Of Line (beol) Interconnect Formation App 20210397084 - BLACKWELL; James M. ;   et al. | 2021-12-23 |
Lined photobucket structure for back end of line (BEOL) interconnect formation Grant 11,137,681 - Blackwell , et al. October 5, 2 | 2021-10-05 |
Hardened plug for improved shorting margin Grant 11,024,538 - Lin , et al. June 1, 2 | 2021-06-01 |
Configurable resistor Grant 11,011,481 - Lin , et al. May 18, 2 | 2021-05-18 |
Advanced Lithography And Self-assembled Devices App 20210082800 - SCHENKER; Richard E. ;   et al. | 2021-03-18 |
Triblock copolymers for self-aligning vias or contacts Grant 10,950,501 - Younkin , et al. March 16, 2 | 2021-03-16 |
Carbon-based Dielectric Materials For Semiconductor Structure Fabrication And The Resulting Structures App 20210057230 - BLACKWELL; James M. ;   et al. | 2021-02-25 |
Photobucket floor colors with selective grafting Grant 10,892,184 - Bristol , et al. January 12, 2 | 2021-01-12 |
Advanced lithography and self-assembled devices Grant 10,892,223 - Schenker , et al. January 12, 2 | 2021-01-12 |
Selective Etching And Controlled Atomic Layer Etching Of Transition Metal Oxide Films For Device Fabrication App 20200395223 - BLACKWELL; James M. ;   et al. | 2020-12-17 |
Surface-aligned lithographic patterning approaches for back end of line (BEOL) interconnect fabrication Grant 10,796,909 - Bristol , et al. October 6, 2 | 2020-10-06 |
Self-aligned via Grant 10,615,117 - Lin , et al. | 2020-04-07 |
Hardened Plug For Improved Shorting Margin App 20200098629 - Lin; Kevin L. ;   et al. | 2020-03-26 |
Advanced Lithography And Self-assembled Devices App 20200066629 - SCHENKER; Richard E. ;   et al. | 2020-02-27 |
Structures and methods for improved lithographic processing Grant 10,490,416 - Bristol , et al. Nov | 2019-11-26 |
Configurable Resistor App 20190355678 - Lin; Kevin L. ;   et al. | 2019-11-21 |
Photobucket Floor Colors With Selective Grafting App 20190318958 - BRISTOL; Robert L. ;   et al. | 2019-10-17 |
Differential Hardmasks For Modulation Of Electrobucket Sensitivity App 20190318959 - LIN; Kevin L. ;   et al. | 2019-10-17 |
Self-aligned Via App 20190311984 - Lin; Kevin L. ;   et al. | 2019-10-10 |
Ligand-capped Main Group Nanoparticles As High Absorption Extreme Ultraviolet Lithography Resists App 20190302615 - KRYSAK; Marie ;   et al. | 2019-10-03 |
Bottom-up Fill Dielectric Materials For Semiconductor Structure Fabrication And Their Methods Of Fabrication App 20190267282 - GSTREIN; Florian ;   et al. | 2019-08-29 |
Surface-aligned Lithographic Patterning Approaches For Back End Of Line (beol) Interconnect Fabrication App 20190244806 - BRISTOL; Robert L. ;   et al. | 2019-08-08 |
Bottom-up selective dielectric cross-linking to prevent via landing shorts Grant 10,366,950 - Lin , et al. July 30, 2 | 2019-07-30 |
Lined Photobucket Structure For Back End Of Line (beol) Interconnect Formation App 20190146335 - BLACKWELL; James M. ;   et al. | 2019-05-16 |
Image tone-reversal with a dielectric using bottom-up cross-linking for back end of line (BEOL) interconnects Grant 10,269,623 - Bristol , et al. | 2019-04-23 |
Two-stage Bake Photoresist With Releasable Quencher App 20190043731 - BRISTOL; Robert L. ;   et al. | 2019-02-07 |
Triblock Copolymers For Self-aligning Vias Or Contacts App 20180323104 - YOUNKIN; Todd R. ;   et al. | 2018-11-08 |
Structures And Methods For Improved Lithographic Processing App 20180294167 - BRISTOL; Robert L. ;   et al. | 2018-10-11 |
Activation Of Protected Cross-linking Catalysts During Formation Of Dielectric Materials App 20180236440 - BLACKWELL; James M. ;   et al. | 2018-08-23 |
Bottom-up Selective Dielectric Cross-linking To Prevent Via Landing Shorts App 20180204797 - LIN; Kevin ;   et al. | 2018-07-19 |
Image Tone-reversal With A Dielectric Using Bottom-up Cross-linking For Back End Of Line (beol) Interconnects App 20180122690 - BRISTOL; Robert L. ;   et al. | 2018-05-03 |
Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD) Grant 9,932,671 - Blackwell , et al. April 3, 2 | 2018-04-03 |
Photodefinable Alignment Layer For Chemical Assisted Patterning App 20170345643 - YOUNKIN; Todd R. ;   et al. | 2017-11-30 |
Precursor and Process Design for Photo-Assisted Metal Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD) App 20170058401 - BLACKWELL; James M. ;   et al. | 2017-03-02 |
Non-lithographically patterned directed self assembly alignment promotion layers Grant 9,570,349 - Bristol , et al. February 14, 2 | 2017-02-14 |
Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regions Grant 9,530,733 - Bristol , et al. December 27, 2 | 2016-12-27 |
Non-lithographically Patterned Directed Self Assembly Alignment Promotion Layers App 20160351449 - BRISTOL; Robert L. ;   et al. | 2016-12-01 |
Non-lithographically patterned directed self assembly alignment promotion layers Grant 9,418,888 - Bristol , et al. August 16, 2 | 2016-08-16 |
Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects Grant 9,406,512 - Bristol , et al. August 2, 2 | 2016-08-02 |
Method of forming a metal from a cobalt metal precursor Grant 9,385,033 - Blackwell , et al. July 5, 2 | 2016-07-05 |
Forming Layers Of Materials Over Small Regions By Selectiv Chemical Reaction Including Limiting Enchroachment Of The Layers Over Adjacent Regions App 20160190060 - Bristol; Robert L. ;   et al. | 2016-06-30 |
Non-lithographically Patterned Directed Self Assembly Alignment Promotion Layers App 20160172237 - Bristol; Robert L. ;   et al. | 2016-06-16 |
Chemically altered carbosilanes for pore sealing applications Grant 9,269,652 - Michalak , et al. February 23, 2 | 2016-02-23 |
Self-aligned Via Patterning With Multi-colored Photobuckets For Back End Of Line (beol) Interconnects App 20150255284 - Bristol; Robert L. ;   et al. | 2015-09-10 |
Additives to improve the performance of a precursor source for cobalt deposition Grant 9,090,964 - Blackwell , et al. July 28, 2 | 2015-07-28 |
Cyclic carbosilane dielectric films Grant 9,070,553 - Michalak , et al. June 30, 2 | 2015-06-30 |
Additives To Improve The Performance Of A Precursor Source For Cobalt Deposition App 20150176119 - Blackwell; James M. ;   et al. | 2015-06-25 |
Self-aligned Via Patterning With Multi-colored Photobuckets For Back End Of Line (beol) Interconnects App 20150171009 - Bristol; Robert L. ;   et al. | 2015-06-18 |
Inverse Nanostructure Dielectric Layers App 20150171029 - Michalak; David J. ;   et al. | 2015-06-18 |
Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects Grant 9,041,217 - Bristol , et al. May 26, 2 | 2015-05-26 |
Cobalt Metal Precursors App 20150093890 - Blackwell; James M. ;   et al. | 2015-04-02 |
Low K Carbosilane Films App 20140004358 - Blackwell; James M. ;   et al. | 2014-01-02 |
Cyclic Carbosilane Dielectric Films App 20130249049 - MICHALAK; DAVID J. ;   et al. | 2013-09-26 |
Cyclic carbosilane dielectric films Grant 8,441,006 - Michalak , et al. May 14, 2 | 2013-05-14 |
Cyclic Carbosilane Dielectric Films App 20120161295 - Michalak; David J. ;   et al. | 2012-06-28 |
Atomic Layer Deposition Of A Copper-containing Seed Layer App 20120070981 - Clendenning; Scott B. ;   et al. | 2012-03-22 |
Dielectric interface for group III-V semiconductor device Grant 7,989,280 - Brask , et al. August 2, 2 | 2011-08-02 |
High K dielectric growth on metal triflate or trifluoroacetate terminated III-V semiconductor surfaces Grant 7,763,317 - Blackwell , et al. July 27, 2 | 2010-07-27 |
Dielectric Interface For Group Iii-v Semiconductor Device App 20090095984 - Brask; Justin K. ;   et al. | 2009-04-16 |
Dielectric interface for group III-V semiconductor device Grant 7,485,503 - Brask , et al. February 3, 2 | 2009-02-03 |
Copper precursors for deposition processes App 20090004385 - Blackwell; James M. ;   et al. | 2009-01-01 |
High K Dielectric Growth On Metal Triflate Or Trifluoroacetate Terminated Iii-v Semiconductor Surfaces App 20080241423 - Blackwell; James M. ;   et al. | 2008-10-02 |
Method of fabricating iridium layer with volatile precursor App 20080160176 - Blackwell; James M. ;   et al. | 2008-07-03 |
Spontaneous copper seed deposition process for metal interconnects App 20080160204 - Lavoie; Adrien R. ;   et al. | 2008-07-03 |
Formation of high metallic content carbon nanotube structures App 20070248794 - Gstrein; Florian ;   et al. | 2007-10-25 |
Dielectric interface for group III-V semiconductor device App 20070123003 - Brask; Justin K. ;   et al. | 2007-05-31 |
Formation of enediynes by reductive coupling followed by alkyne metathesis Grant 6,967,256 - Cummins , et al. November 22, 2 | 2005-11-22 |
Formation of enediynes by reductive coupling followed by alkyne metathesis App 20040215028 - Cummins, Christopher C. ;   et al. | 2004-10-28 |