Blackshear; Edmund D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Blackshear; Edmund D..The latest application filed is for "photonic die fan out package with edge fiber coupling interface and related methods".

Company Profile

4.11.15

Blackshear; Edmund D. - Wappingers Falls NY
Blackshear; Edmund D - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance Grant 10,813,215 - Audet , et al. October 20, 2	2020-10-20
Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance Grant 10,806,030 - Audet , et al. October 13, 2	2020-10-13
Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance Grant 10,687,420 - Audet , et al.	2020-06-16
Photonic die fan out package with edge fiber coupling interface and related methods Grant 10,598,860 - Ramachandran , et al.	2020-03-24
Photonic Die Fan Out Package With Edge Fiber Coupling Interface And Related Methods App 20190285804 - Ramachandran; Koushik ; et al.	2019-09-19
Multi-layer Circuit Using Metal Layers As A Moisture Diffusion Barrier For Electrical Performance App 20160211229 - AUDET; Jean ; et al.	2016-07-21
Multi-layer Circuit Using Metal Layers As A Moisture Diffusion Barrier For Electrical Performance App 20160210398 - AUDET; Jean ; et al.	2016-07-21
Multi-layer Circuit Using Metal Layers As A Moisture Diffusion Barrier For Electrical Performance App 20160211481 - AUDET; Jean ; et al.	2016-07-21
Method for shaping a laminate substrate Grant 9,129,942 - Blackshear September 8, 2	2015-09-08
Fixture for shaping a laminate substrate Grant 9,059,240 - Blackshear , et al. June 16, 2	2015-06-16
Fixture For Shaping A Laminate Substrate App 20130323345 - Blackshear; Edmund D. ; et al.	2013-12-05
Method For Shaping A Laminate Substrate App 20130320578 - Blackshear; Edmund D.	2013-12-05
Chip Carrier Bearing Large Silicon For High Performance Computing And Related Method App 20100164030 - Oggioni; Stefano S. ; et al.	2010-07-01
Electroless Nickel Leveling Of Lga Pad Sites For High Performance Organic Lga App 20090294971 - BLACKSHEAR; Edmund D. ; et al.	2009-12-03
Method, System, And Computer Program Product For Managing Technology Information Associated With A Supply Chain App 20070187474 - Blackshear; Edmund D. ; et al.	2007-08-16
Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same Grant 7,095,104 - Blackshear August 22, 2	2006-08-22
Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same App 20050110125 - Blackshear, Edmund D.	2005-05-26
Vertically stacked memory chips in FBGA packages Grant 6,774,475 - Blackshear , et al. August 10, 2	2004-08-10
Vertically stacked memory chips in FBGA packages App 20030137041 - Blackshear, Edmund D. ; et al.	2003-07-24
High Bandwidth 3d Memory Packaging Technique App 20020117741 - Beausoleil, William F. ; et al.	2002-08-29
Pre-bond encapsulation of area array terminated chip and wafer scale packages App 20020063342 - Blackshear, Edmund D.	2002-05-30
Pre-bond encapsulation of area array terminated chip and wafer scale packages Grant 6,312,972 - Blackshear November 6, 2	2001-11-06

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