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Method and system for wafer level singulation Grant 9,502,294 - Schuegraf , et al. November 22, 2 | 2016-11-22 |
Method And System For Wafer Level Singulation App 20140196850 - Schuegraf; Klaus ;   et al. | 2014-07-17 |
Method and system for wafer level singulation Grant 8,580,615 - Schuegraf , et al. November 12, 2 | 2013-11-12 |
Method And System For Wafer Level Singulation App 20130045570 - Schuegraf; Klaus ;   et al. | 2013-02-21 |
Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils Grant 7,458,335 - Bjorkman December 2, 2 | 2008-12-02 |
Methods And Apparatus For Transferring Conductive Pieces During Semiconductor Device Fabrication App 20080283387 - Rice; Michael R. ;   et al. | 2008-11-20 |
Methods and apparatus for transferring conductive pieces during semiconductor device fabrication Grant 7,407,081 - Rice , et al. August 5, 2 | 2008-08-05 |
Integrated low k dielectrics and etch stops Grant 7,227,244 - Bjorkman , et al. June 5, 2 | 2007-06-05 |
Ashable layers for reducing critical dimensions of integrated circuit features Grant 7,105,442 - Shan , et al. September 12, 2 | 2006-09-12 |
Methods and apparatus for transferring conductive pieces during semiconductor device fabrication App 20050232728 - Rice, Michael R. ;   et al. | 2005-10-20 |
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene Grant 6,949,203 - Hsieh , et al. September 27, 2 | 2005-09-27 |
Integrated method for release and passivation of MEMS structures Grant 6,902,947 - Chinn , et al. June 7, 2 | 2005-06-07 |
Integrated low K dielectrics and etch stops Grant 6,858,153 - Bjorkman , et al. February 22, 2 | 2005-02-22 |
Integrated low k dielectrics and etch stops App 20050023694 - Bjorkman, Claes H. ;   et al. | 2005-02-03 |
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene Grant 6,793,835 - Luo , et al. September 21, 2 | 2004-09-21 |
Flash step preparatory to dielectric etch Grant 6,787,475 - Wang , et al. September 7, 2 | 2004-09-07 |
Integrated method for release and passivation of MEMS structures App 20040033639 - Chinn, Jeffrey D. ;   et al. | 2004-02-19 |
Method of etching a trench in a silicon-containing dielectric material Grant 6,686,293 - Kim , et al. February 3, 2 | 2004-02-03 |
Integrated low k dielectrics and etch stops Grant 6,669,858 - Bjorkman , et al. December 30, 2 | 2003-12-30 |
Ashable layers for reducing critical dimensions of integrated circuit features App 20030219988 - Shan, Hongqing ;   et al. | 2003-11-27 |
Method Of Etching A Trench In A Silicon-containing Dielectric Material App 20030211750 - Kim, Yunsang ;   et al. | 2003-11-13 |
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene App 20030164354 - Hsieh, Chang-Lin ;   et al. | 2003-09-04 |
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene App 20030057179 - Luo, Lee ;   et al. | 2003-03-27 |
Flash step preparatory to dielectric etch App 20030045116 - Wang, Zhuxu ;   et al. | 2003-03-06 |
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene Grant 6,500,357 - Luo , et al. December 31, 2 | 2002-12-31 |
Intergrated low k dielectrics and etch stops App 20020084257 - Bjorkman, Claes H. ;   et al. | 2002-07-04 |
Integrated low k dielectrics and etch stops App 20020074309 - Bjorkman, Claes H. ;   et al. | 2002-06-20 |
Integrated low K dielectrics and etch stops Grant 6,340,435 - Bjorkman , et al. January 22, 2 | 2002-01-22 |