Birgel; Dietmar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Birgel; Dietmar.The latest application filed is for "component that can be soldered in smd technology and method for producing a component that can be soldered in smd technology".

Company Profile

2.6.12

Birgel; Dietmar - Schopfheim DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component That Can Be Soldered In Smd Technology And Method For Producing A Component That Can Be Soldered In Smd Technology App 20220301802 - Strutt; Bernd ; et al.	2022-09-22
Method For Producing A High-temperature Resistant Lead Free Solder Joint, And High-temperature-resistant Lead-free Solder Joint App 20210268593 - Schmidt; Elke ; et al.	2021-09-02
Method for positioning circuit boards and circuit board arrangement Grant 10,721,818 - Girardey , et al.	2020-07-21
Method For Positioning Circuit Boards And Circuit Board Arrangement App 20190124770 - Girardey; Romuald ; et al.	2019-04-25
Method for connecting a component to a support via soldering and component connectable with a support Grant 10,099,318 - Rossberg , et al. October 16, 2	2018-10-16
Method For Connecting A Component To A Support Via Soldering And Component Connectable With A Support App 20150183061 - Rossberg; Andreas ; et al.	2015-07-02
Circuit board with at least one electronic component Grant 7,304,247 - Birgel , et al. December 4, 2	2007-12-04
Circuit Board With Holding Mechanism For Holding Wired Electronic Components Method For Manufacture Of Such A Circuit Board And Their Use In A Soldering Oven App 20070212901 - Birgel; Dietmar ; et al.	2007-09-13
Circuit Board With At Least One Connection Bore For A Connection Wire Or Pin Of A Wired Electronic Component App 20070212934 - Birgel; Dietmar ; et al.	2007-09-13
Electromechanical converter comprising at least one piezoelectric element Grant 7,061,165 - Lopatin , et al. June 13, 2	2006-06-13
Circuit board with SMD-components and at least one wired component, and a method for populating, securing and electrical contacting of the components App 20060037778 - Birgel; Dietmar ; et al.	2006-02-23
Electromechanical transducer Grant 6,946,779 - Birgel September 20, 2	2005-09-20
Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method App 20050161252 - Birgel, Dietmar	2005-07-28
Printed circuit board comprising a contact sleeve that is mounted thereon Grant 6,881,906 - Birgel , et al. April 19, 2	2005-04-19
Circuit board with at least one electronic component App 20050006140 - Birgel, Dietmar ; et al.	2005-01-13
Electromechanical converter comprising at least one piezoelectric element App 20040145280 - Lopatin, Sergej ; et al.	2004-07-29
Printed circuit board comprising a contact sleeve that is mounted thereon App 20040140123 - Birgel, Dietmar ; et al.	2004-07-22
Electromechanical transducer App 20030168945 - Birgel, Dietmar	2003-09-11

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