Biolsi; Peter E.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Biolsi; Peter E..The latest application filed is for "interlevel dielectric layer and metal layer sealing".
- Biolsi; Peter E. - New Windsor NY
- Biolsi; Peter E. - Essex Junction VT
| Patent | Date |
|---|---|
| Interlevel dielectric layer and metal layer sealing Grant 7,214,608 - Angyal , et al. May 8, 2 | 2007-05-08 |
| Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material Grant 7,030,031 - Wille , et al. April 18, 2 | 2006-04-18 |
| Interlevel Dielectric Layer And Metal Layer Sealing App 20060024961 - Angyal; Matthew S. ; et al. | 2006-02-02 |
| Method For Forming Damascene Structure Utilizing Planarizing Material Coupled With Diffusion Barrier Material App 20040266201 - Wille, William C. ; et al. | 2004-12-30 |
| Damascene structure using a sacrificial conductive layer Grant 6,677,678 - Biolsi , et al. January 13, 2 | 2004-01-13 |
| Method of forming a damascene structure using a sacrificial conductive layer and the structure so formed App 20020177301 - Biolsi, Peter E. ; et al. | 2002-11-28 |
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