Bindra; Perminder S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bindra; Perminder S..The latest application filed is for "chemiluminescent powders and methods of making and using thereof".

Company Profile

0.15.3

Bindra; Perminder S. - Fripp Island SC US
Bindra; Perminder S. - South Salem NY
Bindra; Perminder S. - Ossining NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemiluminescent powders and methods of making and using thereof Grant 8,658,066 - Bindra , et al. February 25, 2	2014-02-25
Chemiluminescent Powders And Methods Of Making And Using Thereof App 20110284811 - Bindra; Perminder S. ; et al.	2011-11-24
Chemiluminescent powders and methods of making and using thereof Grant 7,964,119 - Bindra , et al. June 21, 2	2011-06-21
Chemiluminescent Powders And Methods Of Making And Using Thereof App 20100288984 - Bindra; Perminder S. ; et al.	2010-11-18
Chemiluminescent compositions and methods of making and using thereof Grant 7,674,406 - Bindra , et al. March 9, 2	2010-03-09
Chemiluminescent Compositions And Methods Of Making And Using Thereof App 20080308776 - Bindra; Perminder S. ; et al.	2008-12-18
Interconnection method and structure for organic circuit boards Grant 5,435,057 - Bindra , et al. July 25, 1	1995-07-25
Interconnection method and structure for organic circuit boards Grant 5,298,685 - Bindra , et al. March 29, 1	1994-03-29
Encapsulated circuitized power core alignment and lamination Grant 5,229,550 - Bindra , et al. July 20, 1	1993-07-20
Method of fabricating nendritic materials Grant 5,185,073 - Bindra , et al. February 9, 1	1993-02-09
Separable electrical connection technology Grant 5,137,461 - Bindra , et al. August 11, 1	1992-08-11
Encapsulated circuitized power core alignment and lamination Grant 5,129,142 - Bindra , et al. July 14, 1	1992-07-14
Alignment--registration tool for fabricating multi-layer electronic packages Grant 5,048,178 - Bindra , et al. September 17, 1	1991-09-17
Copper plating bath having increased plating rate, and method Grant 4,540,473 - Bindra , et al. September 10, 1	1985-09-10
Method of manufacture employing electrochemically dispersed platinum catalysts deposited on a substrate Grant 4,490,219 - Bindra , et al. December 25, 1	1984-12-25
Method for determination of concentration of organic additive in plating bath Grant 4,479,852 - Bindra , et al. October 30, 1	1984-10-30
Electrolytic cells with alkaline electrolytes containing trifluoromethylane sulfonic acid Grant 4,397,730 - Bindra August 9, 1	1983-08-09

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