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name:-0.021785020828247
name:-0.019042015075684
name:-0.0042300224304199
Binder; Boris Patent Filings

Binder; Boris

Patent Applications and Registrations

Patent applications and USPTO patent grants for Binder; Boris.The latest application filed is for "method for manufacturing a sensor device with a buried deep trench structure and sensor device".

Company Profile
4.22.19
  • Binder; Boris - Dresden DE
  • - Dresden DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Producing a buried cavity in a semiconductor substrate
Grant 11,393,714 - Roeth , et al. July 19, 2
2022-07-19
Method for Manufacturing a Sensor Device with a Buried Deep Trench Structure and Sensor Device
App 20210167117 - Glemet; Magali ;   et al.
2021-06-03
Producing A Buried Cavity In A Semiconductor Substrate
App 20210013087 - ROETH; Andre ;   et al.
2021-01-14
Sensor structures, systems and methods with improved integration and optimized footprint
Grant 10,060,816 - Kautzsch , et al. August 28, 2
2018-08-28
Sensor structures, systems and methods with improved integration and optimized footprint
Grant 9,752,943 - Kautzsch , et al. September 5, 2
2017-09-05
Sensor Structures, Systems And Methods With Improved Integration And Optimized Footprint
App 20170089790 - Kautzsch; Thoralf ;   et al.
2017-03-30
Sensor structures, systems and methods with improved integration and optimized footprint
Grant 9,546,923 - Kautzsch , et al. January 17, 2
2017-01-17
Semiconductor structure with lamella defined by singulation trench
Grant 9,527,725 - Binder , et al. December 27, 2
2016-12-27
Micromechanical system and method for manufacturing a micromechanical system
Grant 9,382,111 - Kautzsch , et al. July 5, 2
2016-07-05
Method for manufacturing a micromechanical system
Grant 9,376,314 - Kautzsch , et al. June 28, 2
2016-06-28
Wafer, a method for processing a wafer, and a method for processing a carrier
Grant 9,236,241 - Kautzsch , et al. January 12, 2
2016-01-12
Micromechanical System And Method For Manufacturing A Micromechanical System
App 20150375999 - Kautzsch; Thoralf ;   et al.
2015-12-31
Micromechanical System And Method For Manufacturing A Micromechanical System
App 20150375998 - Kautzsch; Thoralf ;   et al.
2015-12-31
Wafer, A Method For Processing A Wafer, And A Method For Processing A Carrier
App 20150318166 - KAUTZSCH; Thoralf ;   et al.
2015-11-05
Sensor Structures, Systems And Methods With Improved Integration And Optimized Footprint
App 20150210533 - Kautzsch; Thoralf ;   et al.
2015-07-30
Method Of Fabricating Isolating Semiconductor Structures
App 20150203350 - KAUTZSCH; Thoralf ;   et al.
2015-07-23
Method of fabricating isolating semiconductor structures using a layout of trenches and openings
Grant 8,994,127 - Kautzsch , et al. March 31, 2
2015-03-31
Semiconductor manufacturing and semiconductor device with semiconductor structure
Grant 8,921,974 - Kautzsch , et al. December 30, 2
2014-12-30
Semiconductor manufacturing and semiconductor device with semiconductor structure
Grant 08921974 -
2014-12-30
Method of providing a semiconductor structure with forming a sacrificial structure
Grant 8,921,954 - Kautzsch , et al. December 30, 2
2014-12-30
Semiconductor Structure With Lamella Defined By Singulation Trench
App 20140227818 - Binder; Boris ;   et al.
2014-08-14
Semiconductor structure with lamella defined by singulation trench
Grant 8,723,276 - Binder , et al. May 13, 2
2014-05-13
Acceleration sensor
Grant 8,627,720 - Kautzsch , et al. January 14, 2
2014-01-14
Method Of Providing A Semiconductor Structure With Forming A Sacrificial Structure
App 20130334624 - Kautzsch; Thoralf ;   et al.
2013-12-19
Semiconductor Manufacturing and Semiconductor Device with semiconductor structure
App 20130328143 - KAUTZSCH; Thoralf ;   et al.
2013-12-12
Method of providing a semiconductor structure with forming a sacrificial structure
Grant 8,518,732 - Kautzsch , et al. August 27, 2
2013-08-27
Semiconductor manufacturing and semiconductor device with semiconductor structure
Grant 8,481,400 - Kautzsch , et al. July 9, 2
2013-07-09
Method of fabricating isolated semiconductor structures
App 20130134530 - KAUTZSCH; Thoralf ;   et al.
2013-05-30
Acceleration Sensor
App 20130001712 - Kautzsch; Thoralf ;   et al.
2013-01-03
Acceleration sensor
Grant 8,266,962 - Kautzsch , et al. September 18, 2
2012-09-18
Method of Providing a Semiconductor Structure with Forming A Sacrificial Structure
App 20120161254 - Kautzsch; Thoralf ;   et al.
2012-06-28
Semiconductor Manufacturing and Semiconductor Device with semiconductor structure
App 20120068277 - KAUTZSCH; Thoralf ;   et al.
2012-03-22
Semiconductor Structure with Lamella Defined by Singulation Trench
App 20110068420 - Binder; Boris ;   et al.
2011-03-24
Semiconductor device including a pressure sensor
Grant 7,832,279 - Kautzsch , et al. November 16, 2
2010-11-16
Acceleration Sensor
App 20100186511 - Kautzsch; Thoralf ;   et al.
2010-07-29
Semiconductor Device Including A Pressure Sensor
App 20100058876 - Kautzsch; Thoralf ;   et al.
2010-03-11

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