Bin Mohd Arshad; Mohamad Ashraf
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bin Mohd Arshad; Mohamad Ashraf.The latest application filed is for "sawn leadless package having wettable flank leads".
- Bin Mohd Arshad; Mohamad Ashraf - Kuala Lumpur MY
| Patent | Date |
|---|---|
| Sawn Leadless Package Having Wettable Flank Leads App 20210074587 - Bin Mohd Arshad; Mohamad Ashraf ; et al. | 2021-03-11 |
| Sawn leadless package having wettable flank leads Grant 10,879,121 - Bin Mohd Arshad , et al. December 29, 2 | 2020-12-29 |
| Sawn Leadless Package Having Wettable Flank Leads App 20190035685 - Bin Mohd Arshad; Mohamad Ashraf ; et al. | 2019-01-31 |
| Sawn leadless package having wettable flank leads Grant 10,083,866 - Bin Mohd Arshad , et al. September 25, 2 | 2018-09-25 |
| Sawn Leadless Package Having Wettable Flank Leads App 20180033647 - BIN MOHD ARSHAD; MOHAMAD ASHRAF ; et al. | 2018-02-01 |
| Semiconductor Package With Pre-soldered Grooves In Leads App 20120306065 - Bin Mohd Arshad; Mohamad Ashraf | 2012-12-06 |
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