Bidin; Rahamat
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bidin; Rahamat.The latest application filed is for "subscriber identity module (sim) card".
- Bidin; Rahamat - Singapore SG
| Patent | Date |
|---|---|
| Subscriber identity module (SIM) card Grant 8,544,755 - Bidin , et al. October 1, 2 | 2013-10-01 |
| Subscriber Identity Module (sim) Card App 20110315779 - Bidin; Rahamat ; et al. | 2011-12-29 |
| Multi-die IC package and manufacturing method Grant 7,816,775 - Wang , et al. October 19, 2 | 2010-10-19 |
| Chip Scale Package and Method of Assembling the Same App 20080290509 - Tan; Hien Boon ; et al. | 2008-11-27 |
| Multi-Die Ic Package and Manufacturing Method App 20080150103 - Wang; Chuen Khiang ; et al. | 2008-06-26 |
| Leadframe based chip scale package and method of producing the same Grant 6,420,779 - Sharma , et al. July 16, 2 | 2002-07-16 |
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