Bhatt; Anilkumar C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bhatt; Anilkumar C..The latest application filed is for "printed wiring board".

Company Profile

0.19.7

Bhatt; Anilkumar C. - Johnson City NY
Bhatt; Anilkumar C. - Johnson NY
Bhatt; Anilkumar C. - Endicott NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for recovering an organic solvent from a waste stream containing supercritical CO2 Grant 6,946,055 - Bhatt , et al. September 20, 2	2005-09-20
Method of fabricating printed circuit board with mixed metallurgy pads Grant 6,931,722 - Arrington , et al. August 23, 2	2005-08-23
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same Grant 6,781,064 - Appelt , et al. August 24, 2	2004-08-24
Printed wiring board Grant 6,740,819 - Bhatt , et al. May 25, 2	2004-05-25
Dielectric structure and method of formation Grant 6,699,350 - Bhatt , et al. March 2, 2	2004-03-02
Full additive process with filled plated through holes Grant 6,664,485 - Bhatt , et al. December 16, 2	2003-12-16
Printed wiring board App 20030188890 - Bhatt, Anilkumar C. ; et al.	2003-10-09
Printed circuit board with mixed metallurgy pads and method of fabrication App 20030177635 - Arrington, Edward L. ; et al.	2003-09-25
Method for making a printed wiring board Grant 6,608,757 - Bhatt , et al. August 19, 2	2003-08-19
Method for recovering an organic solvent from a waste stream containing supercritical CO2 App 20030044340 - Bhatt, Anilkumar C. ; et al.	2003-03-06
Dielectric structure and method of formation App 20030010440 - Bhatt, Anilkumar C. ; et al.	2003-01-16
Printed circuit board with mixed metallurgy pads and method of fabrication App 20020157861 - Arrington, Edward L. ; et al.	2002-10-31
Method of filling plated through holes Grant 6,453,549 - Bhatt , et al. September 24, 2	2002-09-24
Method of preparing a printed circuit board Grant RE37,840 - Bhatt , et al. September 17, 2	2002-09-17
Full additive process with filled plated through holes App 20010009066 - Bhatt, Anilkumar C. ; et al.	2001-07-26
Full additive process with filled plated through holes App 20010007289 - Bhatt, Anilkumar C. ; et al.	2001-07-12
Method of making a circuitized substrate with an aperture Grant 6,221,694 - Bhatt , et al. April 24, 2	2001-04-24
Full additive process with filled plated through holes Grant 6,195,883 - Bhatt , et al. March 6, 2	2001-03-06
Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol Grant 5,637,442 - Bhatt , et al. June 10, 1	1997-06-10
Method of preparing a printed circuit board Grant 5,557,844 - Bhatt , et al. September 24, 1	1996-09-24
Method for making printed circuit boards with selectivity filled plated through holes Grant 5,487,218 - Bhatt , et al. January 30, 1	1996-01-30
Methyl chloroform-free desmear process in additive circuitization Grant 5,311,660 - Alpaugh , et al. May 17, 1	1994-05-17
Photoresist develop and strip solvent compositions and method for their use Grant 5,268,260 - Bantu , et al. December 7, 1	1993-12-07
Electrode array and use thereof Grant 5,156,730 - Bhatt , et al. October 20, 1	1992-10-20
Phenolic-free stripping composition and use thereof Grant 4,971,715 - Armant , et al. November 20, 1	1990-11-20
Process for coating fibers, use thereof, and product Grant 4,749,614 - Andrews , et al. June 7, 1	1988-06-07

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