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Patent applications and USPTO patent grants for Bhatkal; Ravindra M.The latest application filed is for "dielectric ink composition".
Patent | Date |
---|---|
Advanced solder alloys for electronic interconnects Grant 11,411,150 - de Avila Ribas , et al. August 9, 2 | 2022-08-09 |
Dielectric Ink Composition App 20220064466 - PUJARI; Narahari ;   et al. | 2022-03-03 |
Dielectric ink composition Grant 11,193,031 - Pujari , et al. December 7, 2 | 2021-12-07 |
Dielectric Ink Composition App 20200190347 - PUJARI; Narahari ;   et al. | 2020-06-18 |
Advanced Solder Alloys For Electronic Interconnects App 20190157535 - de Avila Ribas; Morgana ;   et al. | 2019-05-23 |
Advanced Solder Alloys For Electronic Interconnects App 20180102464 - de Avila Ribas; Morgana ;   et al. | 2018-04-12 |
Solder Compositions App 20140199115 - de Avila Ribas; Morgana ;   et al. | 2014-07-17 |
Electroformed stencils for solar cell front side metallization Grant 7,749,883 - Meeus , et al. July 6, 2 | 2010-07-06 |
Electroformed Stencils For Solar Cell Front Side Metallization App 20090081823 - Meeus; Thomas ;   et al. | 2009-03-26 |
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