Bhatkal; Ravi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bhatkal; Ravi.The latest application filed is for "sintering powder".
- Bhatkal; Ravi - East Brunswick NJ
- BHATKAL; Ravi - Waterbury CT
- Bhatkal; Ravi - South Plainfield NJ
| Patent | Date |
|---|---|
| Sintering Powder App 20220169905 - Ghosal; Shamik ; et al. | 2022-06-02 |
| Stretchable Interconnects for Flexible Electronic Surfaces App 20210350949 - PUJARI; Narahari ; et al. | 2021-11-11 |
| Sintering paste Grant 11,162,007 - Ghosal , et al. November 2, 2 | 2021-11-02 |
| Stretchable interconnects for flexible electronic surfaces Grant 11,139,089 - Pujari , et al. October 5, 2 | 2021-10-05 |
| Lead-free and antimony-free tin solder reliable at high temperatures Grant 11,090,768 - Choudhury , et al. August 17, 2 | 2021-08-17 |
| Stretchable Interconnects for Flexible Electronic Surfaces App 20200294686 - PUJARI; Narahari ; et al. | 2020-09-17 |
| Stretchable interconnects for flexible electronic surfaces Grant 10,672,531 - Pujari , et al. | 2020-06-02 |
| Sintering Powder App 20190194517 - Ghosal; Shamik ; et al. | 2019-06-27 |
| Sintering powder Grant 10,259,980 - Ghosal , et al. | 2019-04-16 |
| Stretchable Interconnects for Flexible Electronic Surfaces App 20170200527 - PUJARI; Narahari ; et al. | 2017-07-13 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20160023309 - Choudhury; Pritha ; et al. | 2016-01-28 |
| Sintering Powder App 20150353804 - Ghosal; Shamik ; et al. | 2015-12-10 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150266137 - Choudhury; Pritha ; et al. | 2015-09-24 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150224604 - Choudhury; Pritha ; et al. | 2015-08-13 |
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