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Package-integrated Multi-turn Coil Embedded In A Package Magnetic Core
App 20220310512 - Do; Huong ; et al. | 2022-09-29 |
Microelectronic assemblies having magnetic core inductors
Grant 11,450,560 - Bharath , et al. September 20, 2 | 2022-09-20 |
Dies with integrated voltage regulators
Grant 11,417,593 - Elsherbini , et al. August 16, 2 | 2022-08-16 |
Multi-layer embedded magnetic inductor coil
Grant 11,404,364 - Do , et al. August 2, 2 | 2022-08-02 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20220231394 - ELSHERBINI; Adel A. ; et al. | 2022-07-21 |
Package-integrated multi-turn coil embedded in a package magnetic core
Grant 11,393,751 - Do , et al. July 19, 2 | 2022-07-19 |
Multi-level distributed clamps
Grant 11,380,652 - Choi , et al. July 5, 2 | 2022-07-05 |
Integrated cross-domain power transfer voltage regulators
Grant 11,353,900 - Choi , et al. June 7, 2 | 2022-06-07 |
Low loss and low cross talk transmission lines having l-shaped cross sections
Grant 11,329,358 - Elsherbini , et al. May 10, 2 | 2022-05-10 |
Stepped Coax Mil Pths For Modulating Inductance Within A Package
App 20220102055 - MARIN; Brandon C. ; et al. | 2022-03-31 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20220102261 - ELSHERBINI; Adel A. ; et al. | 2022-03-31 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093546 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Package Embedded Magnetic Power Transformers For Smps
App 20220093314 - MODI; Anuj ; et al. | 2022-03-24 |
Multi-phase Switching Regulators With Hybrid Inductors And Per Phase Frequency Control
App 20220094263 - BHARATH; Krishna ; et al. | 2022-03-24 |
Stacked Die And Vr Chiplet With Dual-sided And Unidirectional Current Flow
App 20220093565 - RADHAKRISHNAN; Kaladhar ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093492 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Magnetic Core Inductors In Interposer
App 20220093536 - BHARATH; Krishna ; et al. | 2022-03-24 |
High performance integrated RF passives using dual lithography process
Grant 11,227,825 - Elsherbini , et al. January 18, 2 | 2022-01-18 |
Reconfigurable inductor
Grant 11,211,866 - Lambert , et al. December 28, 2 | 2021-12-28 |
Power Delivery Structures
App 20210398895 - Elsherbini; Adel ; et al. | 2021-12-23 |
Electrostatic discharge protection in integrated circuits
Grant 11,189,580 - Elsherbini , et al. November 30, 2 | 2021-11-30 |
Semiconductor Packaging With High Density Interconnects
App 20210193583 - ELSHERBINI; Adel A. ; et al. | 2021-06-24 |
Electrostatic Discharge Protection In Integrated Circuits
App 20210193595 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Enhanced Integrated Circuit Component Power Delivery
App 20210183846 - Smalley; Jeffory L. ; et al. | 2021-06-17 |
Coaxial Magnetic Inductors With Pre-fabricated Ferrite Cores
App 20210104475 - RADHAKRISHNAN; Kaladhar ; et al. | 2021-04-08 |
Package power delivery using plane and shaped vias
Grant 10,971,416 - Bharath , et al. April 6, 2 | 2021-04-06 |
Semiconductor packaging with high density interconnects
Grant 10,971,453 - Elsherbini , et al. April 6, 2 | 2021-04-06 |
Via-in-via Structure For High Density Package Integrated Inductor
App 20210098436 - Bharath; Krishna ; et al. | 2021-04-01 |
Reconfigurable Inductor
App 20210036618 - Lambert; WILLIAM J. ; et al. | 2021-02-04 |
Multi-level Distributed Clamps
App 20200251448 - Kind Code | 2020-08-06 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20200235449 - ELSHERBINI; Adel A. ; et al. | 2020-07-23 |
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs
Grant 10,651,525 - Elsherbini , et al. | 2020-05-12 |
Microelectronic Assemblies Having An Integrated Voltage Regulator Chiplet
App 20200105653 - Elsherbini; Adel A. ; et al. | 2020-04-02 |
Microelectronic Assemblies Having Magnetic Core Inductors
App 20200098621 - Bharath; Krishna ; et al. | 2020-03-26 |
Dies With Integrated Voltage Regulators
App 20200098676 - Elsherbini; Adel A. ; et al. | 2020-03-26 |
Integrated Circuit Package Supports Having Inductors With Magnetic Material
App 20200091053 - Paital; Sameer ; et al. | 2020-03-19 |
Multi-layer Embedded Magnetic Inductor Coil
App 20200066627 - Do; Huong ; et al. | 2020-02-27 |
Package-integrated Multi-turn Coil Embedded In A Package Magnetic Core
App 20200066634 - Do; Huong ; et al. | 2020-02-27 |
Magnetic Core Inductors On Package Substrates
App 20200066830 - Bharath; Krishna ; et al. | 2020-02-27 |
Integrated Thin Film Capacitors On A Glass Core Substrate
App 20200013770 - Elsherbini; Adel ; et al. | 2020-01-09 |
Integrated Cross-domain Power Transfer Voltage Regulators
App 20200004282 - Choi; Beomseok ; et al. | 2020-01-02 |
Fully Integrated Voltage Regulator Circuitry Within A Substrate
App 20200006239 - ZHANG; Chong ; et al. | 2020-01-02 |
Integrated Heterogenous Power Management Circuitries
App 20200006305 - Lambert; William J. ; et al. | 2020-01-02 |
Integrated Magnetic Core Inductors On Glass Core Substrates
App 20200005989 - Bharath; Krishna ; et al. | 2020-01-02 |
Apparatus and method to reduce power losses in an integrated voltage regulator
Grant 10,503,227 - Bharath , et al. Dec | 2019-12-10 |
Package Power Delivery Using Plane And Shaped Vias
App 20190355636 - Bharath; Krishna ; et al. | 2019-11-21 |
Package power delivery using plane and shaped vias
Grant 10,410,939 - Bharath , et al. Sept | 2019-09-10 |
Semiconductor Packaging With High Density Interconnects
App 20190259705 - Elsherbini; Adel A. ; et al. | 2019-08-22 |
Package-integrated microchannels
Grant 10,186,465 - Eid , et al. Ja | 2019-01-22 |
Improved Package Power Delivery Using Plane And Shaped Vias
App 20180331003 - BHARATH; Krishna ; et al. | 2018-11-15 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20180315690 - ELSHERBINI; Adel A. ; et al. | 2018-11-01 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20180288868 - ELSHERBINI; Adel A. ; et al. | 2018-10-04 |
Package-integrated Microchannels
App 20180226310 - EID; Feras ; et al. | 2018-08-09 |
Low loss and low cross talk transmission lines using shaped vias
Grant 9,992,859 - Elsherbini , et al. June 5, 2 | 2018-06-05 |
Apparatus And Method To Reduce Power Losses In An Integrated Voltage Regulator
App 20180101207 - Bharath; Krishna ; et al. | 2018-04-12 |
Apparatus and method to reduce power losses in an integrated voltage regulator
Grant 9,753,510 - Bharath , et al. September 5, 2 | 2017-09-05 |
Package Integrated Power Inductors Using Lithographically Defined Vias
App 20170092412 - Manusharow; Mathew J. ; et al. | 2017-03-30 |
Low Loss and Low Cross Talk Transmission Lines using Shaped Vias
App 20170093007 - ELSHERBINI; Adel A. ; et al. | 2017-03-30 |
Reliable microstrip routing for electronics components
Grant 9,607,947 - Karhade , et al. March 28, 2 | 2017-03-28 |
Apparatus And Method To Reduce Power Losses In An Integrated Voltage Regulator
App 20170060205 - Bharath; Krishna ; et al. | 2017-03-02 |
Reliable Microstrip Routing For Electronics Components
App 20160300796 - Karhade; Omkar G. ; et al. | 2016-10-13 |
Reliable microstrip routing for electronics components
Grant 9,391,025 - Karhade , et al. July 12, 2 | 2016-07-12 |
Magnetic core inductor (MCI) structures for integrated voltage regulators
Grant 9,129,817 - Elsherbini , et al. September 8, 2 | 2015-09-08 |
Reliable Microstrip Routing For Electronics Components
App 20150228583 - Karhade; Omkar G. ; et al. | 2015-08-13 |
Reliable microstrip routing for electronics components
Grant 9,041,205 - Karhade , et al. May 26, 2 | 2015-05-26 |
Reliable Microstrip Routing For Electronics Components
App 20150001733 - Karhade; Omkar G. ; et al. | 2015-01-01 |
Magnetic Core Inductor (mci) Structures For Integrated Voltage Regulators
App 20140264732 - Elsherbini; Adel A. ; et al. | 2014-09-18 |
Semiconductor Package With Air Core Inductor (aci) And Magnetic Core Inductor (mci)
App 20140217547 - Elsherbini; Adel A. ; et al. | 2014-08-07 |
Multi-layer finite element method for modeling of package power and ground planes
Grant 8,219,377 - Bharath , et al. July 10, 2 | 2012-07-10 |
Multi-Layer Finite Element Method for Modeling of Package Power and Ground Planes
App 20100217576 - Bharath; Krishna ; et al. | 2010-08-26 |
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