| Patent | Date |
|---|
Method for packaging semiconductor dies
Grant 11,367,705 - Beyne June 21, 2 | 2022-06-21 |
Method And System To Produce Dies For A Wafer Reconstitution
App 20220189830 - BEYNE; Eric ; et al. | 2022-06-16 |
Method for the electrical bonding of semiconductor components
Grant 11,362,061 - Hou , et al. June 14, 2 | 2022-06-14 |
Method for fabricating an optical device
Grant 11,316,066 - Steudel , et al. April 26, 2 | 2022-04-26 |
Substrate, Assembly And Method For Wafer-to-wafer Hybrid Bonding
App 20220037283 - De Vos; Joeri ; et al. | 2022-02-03 |
Method For Bonding Semiconductor Components
App 20210159207 - Derakhshandeh; Jaber ; et al. | 2021-05-27 |
Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC
Grant 10,985,057 - Jourdain , et al. April 20, 2 | 2021-04-20 |
Method for Dicing a Semiconductor Substrate into a Plurality of Dies
App 20210098299 - Holsteyns; Frank ; et al. | 2021-04-01 |
Method of bonding semiconductor substrates
Grant 10,886,252 - Peng , et al. January 5, 2 | 2021-01-05 |
Method For The Electrical Bonding Of Semiconductor Components
App 20200402950 - Hou; Lin ; et al. | 2020-12-24 |
Method for bonding semiconductor chips to a landing wafer
Grant 10,797,016 - Dubey , et al. October 6, 2 | 2020-10-06 |
Method For Packaging Semiconductor Dies
App 20200203309 - Beyne; Eric | 2020-06-25 |
Method for Fabricating an Optical Device
App 20200185566 - Steudel; Soeren ; et al. | 2020-06-11 |
Method For Contacting A Buried Interconnect Rail Of An Integrated Circuit Chip From The Back Side Of The Ic
App 20200152508 - Jourdain; Anne ; et al. | 2020-05-14 |
Integrated circuit chip with power delivery network on the backside of the chip
Grant 10,636,739 - Beyne , et al. | 2020-04-28 |
Method For Packaging Semiconductor Dies
App 20200118840 - Beyne; Eric | 2020-04-16 |
Liquid cooling of electronic devices
Grant 10,334,755 - Oprins , et al. | 2019-06-25 |
Method for producing contact areas on a semiconductor substrate
Grant 10,332,850 - Beyne , et al. | 2019-06-25 |
Biocompatible packaging
Grant 10,271,796 - Op De Beeck , et al. | 2019-04-30 |
MIMCAP structure in a semiconductor device package
Grant 10,256,183 - Detalle , et al. | 2019-04-09 |
Method for bonding and interconnecting integrated circuit devices
Grant 10,170,450 - Beyne , et al. J | 2019-01-01 |
Method of bonding semiconductor substrates
Grant 10,141,284 - Kim , et al. Nov | 2018-11-27 |
Thin NiB or CoB capping layer for non-noble metallic bonding landing pads
Grant 10,066,303 - Beyne , et al. September 4, 2 | 2018-09-04 |
Method Of Bonding Semiconductor Substrates
App 20180247914 - Peng; Lan ; et al. | 2018-08-30 |
Integrated Circuit Chip With Power Delivery Network On The Backside Of The Chip
App 20180145030 - Beyne; Eric ; et al. | 2018-05-24 |
Method for self-aligned solder reflow bonding and devices obtained thereof
Grant 9,978,710 - Dubey , et al. May 22, 2 | 2018-05-22 |
Method For Bonding Semiconductor Chips To A Landing Wafer
App 20180130765 - Dubey; Vikas ; et al. | 2018-05-10 |
Semiconductor die package and method of producing the package
Grant 9,966,325 - Beyne May 8, 2 | 2018-05-08 |
Method for bonding and interconnecting integrated circuit devices
Grant 9,960,080 - Beyne May 1, 2 | 2018-05-01 |
Method For Bonding And Interconnecting Integrated Circuit Devices
App 20180068984 - Beyne; Eric ; et al. | 2018-03-08 |
Semiconductor Die Package And Method Of Producing The Package
App 20180061741 - Beyne; Eric | 2018-03-01 |
Method for aligning micro-electronic components
Grant 9,799,632 - Dubey , et al. October 24, 2 | 2017-10-24 |
Method Of Bonding Semiconductor Substrates
App 20170301646 - Kim; Soon-Wook ; et al. | 2017-10-19 |
Method For Self-aligned Solder Reflow Bonding And Devices Obtained Thereof
App 20170194283 - Dubey; Vikas ; et al. | 2017-07-06 |
Liquid Cooling Of Electronic Devices
App 20170196120 - Oprins; Herman ; et al. | 2017-07-06 |
Mimcap Structure In A Semiconductor Device Package
App 20170194246 - Detalle; Mikael ; et al. | 2017-07-06 |
Method for Aligning Micro-Electronic Components
App 20170186733 - Dubey; Vikas ; et al. | 2017-06-29 |
Semiconductor device having through-substrate vias
Grant 9,646,930 - Tezcan , et al. May 9, 2 | 2017-05-09 |
Method for aligning micro-electronic components
Grant 9,601,459 - Dubey , et al. March 21, 2 | 2017-03-21 |
Method For Bonding And Interconnecting Integrated Circuit Devices
App 20170005000 - Beyne; Eric | 2017-01-05 |
Method for insertion bonding and device thus obtained
Grant 9,508,665 - Beyne , et al. November 29, 2 | 2016-11-29 |
Mimcap Structure In A Semiconductor Device Package
App 20160155699 - Detalle; Mikael ; et al. | 2016-06-02 |
Biocompatible Packaging
App 20150297136 - Op De Beeck; Maria ; et al. | 2015-10-22 |
Thin Nib Or Cob Capping Layer For Non-noble Metallic Bonding Landing Pads
App 20150247244 - Beyne; Eric ; et al. | 2015-09-03 |
Method for Aligning Micro-Electronic Components
App 20150179605 - Dubey; Vikas ; et al. | 2015-06-25 |
Biocompatible packaging
Grant 9,048,198 - Op De Beeck , et al. June 2, 2 | 2015-06-02 |
Semiconductor Device Having Through-substrate Vias
App 20150035168 - Tezcan; Deniz Sabuncuoglu ; et al. | 2015-02-05 |
Method for Producing Contact Areas on a Semiconductor Substrate
App 20140374919 - Beyne; Eric ; et al. | 2014-12-25 |
Window interposed die packaging
Grant 8,907,471 - Beyne , et al. December 9, 2 | 2014-12-09 |
Method for providing oxide layers
Grant 8,822,330 - Soussan , et al. September 2, 2 | 2014-09-02 |
Method for fabricating through substrate vias
Grant 8,809,188 - Tezcan , et al. August 19, 2 | 2014-08-19 |
Mimcap Structure In A Semiconductor Device Package
App 20140151848 - Detalle; Mikael ; et al. | 2014-06-05 |
Method for forming isolation trenches
Grant 8,742,590 - Beyne June 3, 2 | 2014-06-03 |
Method for detecting embedded voids in a semiconductor substrate
Grant 8,735,182 - Leunissen , et al. May 27, 2 | 2014-05-27 |
Method for forming 3D-interconnect structures with airgaps
Grant 8,647,920 - Tezcan , et al. February 11, 2 | 2014-02-11 |
Methods and systems for material bonding
Grant 8,536,047 - Zhang , et al. September 17, 2 | 2013-09-17 |
Method Of Redistributing Functional Element
App 20130237055 - Funaya; Takuo ; et al. | 2013-09-12 |
Device for cooling integrated circuits
Grant 8,493,736 - Oprins , et al. July 23, 2 | 2013-07-23 |
Method for Forming Isolation Trenches in Micro-Bump Interconnect Structures and Devices Obtained Thereof
App 20130154112 - Zhang; Wenqi ; et al. | 2013-06-20 |
Semiconductor package
Grant 8,450,825 - Limaye , et al. May 28, 2 | 2013-05-28 |
Method for aligning and bonding elements and a device comprising aligned and bonded elements
Grant 8,440,504 - Soussan , et al. May 14, 2 | 2013-05-14 |
Method for Detecting Embedded Voids in a Semiconductor Substrate
App 20120315712 - Leunissen; Leonardus ; et al. | 2012-12-13 |
Window Interposed Die Packaging
App 20120280381 - Beyne; Eric ; et al. | 2012-11-08 |
Biocompatible Packaging
App 20120209100 - DE BEECK; Maria OP ; et al. | 2012-08-16 |
Method For Forming Isolation Trenches
App 20120139127 - Beyne; Eric | 2012-06-07 |
Method For Forming 3d-interconnect Structures With Airgaps
App 20120013022 - Sabuncuoglu Tezcan; Deniz ; et al. | 2012-01-19 |
Device For Cooling Integrated Circuits
App 20110304987 - Oprins; Herman ; et al. | 2011-12-15 |
Methods And Systems For Material Bonding
App 20110233792 - Zhang; Wenqi ; et al. | 2011-09-29 |
Method For Fabricating Through Substrate Vias
App 20110089572 - Tezcan; Deniz Sabuncuoglu ; et al. | 2011-04-21 |
Method For Providing Oxide Layers
App 20110086507 - Soussan; Philippe ; et al. | 2011-04-14 |
Semiconductor Package
App 20110037179 - Limaye; Paresh ; et al. | 2011-02-17 |
Method For Insertion Bonding And Device Thus Obtained
App 20110027967 - Beyne; Eric ; et al. | 2011-02-03 |
Methods for bonding and micro-electronic devices produced according to such methods
Grant 7,880,315 - Beyne , et al. February 1, 2 | 2011-02-01 |
System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
Grant 7,835,157 - Tilmans , et al. November 16, 2 | 2010-11-16 |
Method for bonding a die or substrate to a carrier
Grant 7,795,113 - Swinnen , et al. September 14, 2 | 2010-09-14 |
Connecting Scheme for Orthogonal Assembly of Microstructures
App 20100178810 - Aarts; Arno ; et al. | 2010-07-15 |
Device having a bonding structure for two elements
Grant 7,737,552 - Beyne June 15, 2 | 2010-06-15 |
Plurality of devices attached by solder bumps
Grant 7,687,904 - De Raedt , et al. March 30, 2 | 2010-03-30 |
Connecting Scheme for Orthogonal Assembly of Microstructures
App 20090325424 - Aarts; Arno ; et al. | 2009-12-31 |
Methods For Bonding And Micro-electronic Devices Produced According To Such Methods
App 20090218702 - Beyne; Eric ; et al. | 2009-09-03 |
Method for chip singulation
Grant 7,566,634 - Beyne , et al. July 28, 2 | 2009-07-28 |
Methods for bonding and micro-electronic devices produced according to such methods
Grant 7,547,625 - Beyne , et al. June 16, 2 | 2009-06-16 |
Device Having A Bonding Structure For Two Elements
App 20080224312 - Beyne; Eric | 2008-09-18 |
Method For Bonding A Die Or Substrate To A Carrier
App 20080166525 - Swinnen; Bart ; et al. | 2008-07-10 |
Method And System For Fabrication Of Integrated Tunable/switchable Passive Microwave And Millimeter Wave Modules
App 20080157897 - Tilmans; Hendrikus ; et al. | 2008-07-03 |
Methods of bonding two semiconductor devices
Grant 7,378,297 - Beyne May 27, 2 | 2008-05-27 |
Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
Grant 7,368,311 - Tilmans , et al. May 6, 2 | 2008-05-06 |
Method for forming packaged microelectronic devices and devices thus obtained
App 20080046080 - Vanden Bulcke; Mathieu ; et al. | 2008-02-21 |
Methods For Bonding And Devices According To Such Methods
App 20070182012 - DeRaedt; Walter ; et al. | 2007-08-09 |
Methods of bonding two semiconductor devices
Grant 7,205,177 - De Raedt , et al. April 17, 2 | 2007-04-17 |
Methods for protecting metal surfaces
App 20070071900 - Soussan; Philippe ; et al. | 2007-03-29 |
Semiconductor device and method of producing the same
App 20070040281 - Nakayama; Hirokazu ; et al. | 2007-02-22 |
Methods for bonding and devices according to such methods
App 20070026568 - Beyne; Eric | 2007-02-01 |
Methods for bonding and micro-electronic devices produced according to such methods
App 20060292824 - Beyne; Eric ; et al. | 2006-12-28 |
Method for chip singulation
App 20060068567 - Beyne; Eric ; et al. | 2006-03-30 |
Methods for bonding and devices according to such methods
App 20060012037 - Raedt; Walter De ; et al. | 2006-01-19 |
Method for producing electrical through hole interconnects and devices made thereof
Grant 6,908,856 - Beyne , et al. June 21, 2 | 2005-06-21 |
Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
Grant 6,876,056 - Tilmans , et al. April 5, 2 | 2005-04-05 |
Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
App 20050003606 - Tilmans, Hendrikus ; et al. | 2005-01-06 |
Method for producing electrical through hole interconnects and devices made thereof
App 20040259292 - Beyne, Eric ; et al. | 2004-12-23 |
Method for transferring and stacking of semiconductor devices
Grant 6,812,078 - Borghs , et al. November 2, 2 | 2004-11-02 |
Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device
Grant 6,730,997 - Beyne , et al. May 4, 2 | 2004-05-04 |
Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base
Grant 6,711,813 - Beyne , et al. March 30, 2 | 2004-03-30 |
Method for transferring and stacking of semiconductor devices
App 20040029329 - Borghs, Staf ; et al. | 2004-02-12 |
Image sensor ball grid array package and the fabrication thereof
Grant 6,566,745 - Beyne , et al. May 20, 2 | 2003-05-20 |
Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device
App 20030060034 - Beyne, Eric ; et al. | 2003-03-27 |
Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
App 20030042567 - Tilmans, Hendrikus ; et al. | 2003-03-06 |
Method For Transferring And Stacking Of Semiconductor Devices
App 20030040145 - Borghs, Staf ; et al. | 2003-02-27 |
Polymer stud grid array
Grant 6,518,088 - Heerman , et al. February 11, 2 | 2003-02-11 |
Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device
Grant 6,506,664 - Beyne , et al. January 14, 2 | 2003-01-14 |
Imager or particle or radiation detector and method of manufacturing the same
Grant 6,362,484 - Beyne , et al. March 26, 2 | 2002-03-26 |
Method of fabrication of a microstructure having an internal cavity
App 20020000649 - Tilmans, Hendrikus A.C. ; et al. | 2002-01-03 |
Method of fabrication of a microstructure having an internal cavity
Grant 6,297,072 - Tilmans , et al. October 2, 2 | 2001-10-02 |
Wide frequency band planar antenna
Grant 6,278,410 - Soliman , et al. August 21, 2 | 2001-08-21 |
Polymer stud grid array
Grant 6,249,048 - Heerman , et al. June 19, 2 | 2001-06-19 |
Polymer stud grid array for microwave circuit arrangements
Grant 6,130,478 - Dumoulin , et al. October 10, 2 | 2000-10-10 |
Polymer stud grid array
Grant 6,122,172 - Dumoulin , et al. September 19, 2 | 2000-09-19 |
Imager or particle detector and method of manufacturing the same
Grant 6,121,622 - Beyne , et al. September 19, 2 | 2000-09-19 |
Polymer stud grid array
Grant 5,929,516 - Heerman , et al. July 27, 1 | 1999-07-27 |
Position sensitive particle sensor and manufacturing method therefor
Grant 5,731,584 - Beyne , et al. March 24, 1 | 1998-03-24 |
Microwave oscillator, an antenna therefor and methods of manufacture
Grant 5,675,295 - Brebels , et al. October 7, 1 | 1997-10-07 |
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