Betz; Bernd

Patent Applications and Registrations

Patent applications and USPTO patent grants for Betz; Bernd.The latest application filed is for "semiconductor package and method for fabricating a semiconductor package".

Company Profile

1.7.7

Betz; Bernd - Obertraubling / Oberhinkofen DE
Betz; Bernd - Oberhinkofen DE
Betz; Bernd - Neutraubling DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and method for fabricating a semiconductor package Grant 11,410,906 - Hoegerl , et al. August 9, 2	2022-08-09
Semiconductor Package and Method for Fabricating a Semiconductor Package App 20200395266 - Hoegerl; Juergen ; et al.	2020-12-17
Process for producing and apparatus for improving the bonding between a plastic and a metal Grant 7,732,333 - Betz , et al. June 8, 2	2010-06-08
Semiconductor device with semiconductor device components embedded in a plastic housing composition Grant 7,705,472 - Mahler , et al. April 27, 2	2010-04-27
Integrated circuit component with passivation layer Grant 7,642,641 - Mahler , et al. January 5, 2	2010-01-05
Method and use of a device for applying coatings to band-like structures during the production of semiconductor components Grant 7,635,612 - Betz , et al. December 22, 2	2009-12-22
MID module and a method of mounting an optical fibre in an MID module Grant 7,597,484 - Ghahremani , et al. October 6, 2	2009-10-06
Process for Producing and Apparatus for Improving the Bonding Between a Plastic and a Metal App 20080258281 - Betz; Bernd ; et al.	2008-10-23
Radiofrequency power semiconductor module with cavity housing, and method for producing it Grant 7,417,198 - Betz , et al. August 26, 2	2008-08-26
Mid Module And A Method Of Mounting An Optical Fibre In An Mid Module App 20080152285 - Ghahremani; Cyrus ; et al.	2008-06-26
Integrated circuit component with passivation layer and methods for making the same App 20080093728 - Mahler; Joachim ; et al.	2008-04-24
Semiconductor Device with Semiconductor Device Components Embedded in a Plastic Housing Composition App 20070145606 - Mahler; Joachim ; et al.	2007-06-28
Method and use of a device for applying coatings to band-like structures during the production of semiconductor components App 20070128371 - Betz; Bernd ; et al.	2007-06-07
High-frequency power semiconductor module with a hollow housing and method for the production thereof App 20060012016 - Betz; Bernd ; et al.	2006-01-19

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