BESTAC ADVANCED MATERIAL CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for BESTAC ADVANCED MATERIAL CO., LTD..The latest application filed is for "polishing pad, use thereof and method for making the same".

Company Profile

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BESTAC ADVANCED MATERIAL CO., LTD. - Taoyuan County TW
Bestac Advanced Material Co., Ltd. - Tao-Yuan Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing equipment having discontinuous adhesion points and method for making the sheet Grant 9,889,630 - Feng , et al. February 13, 2	2018-02-13
Polishing pad, use thereof and method for making the same Grant 8,491,359 - Feng , et al. July 23, 2	2013-07-23
Conductive polishing pad and method for making the same Grant 8,343,586 - Feng , et al. January 1, 2	2013-01-01
Polishing pad and polishing device Grant 8,277,290 - Chiu , et al. October 2, 2	2012-10-02
Polishing pad Grant 8,123,597 - Chiu , et al. February 28, 2	2012-02-28
Polishing Pad, Use Thereof and Method for Making the Same App 20110045744 - Feng; Chung-Chih ; et al.	2011-02-24
Sheet Having Discontinuous Adhesion Points And Method For Making The Same App 20100227118 - Feng; Chung-Chih ; et al.	2010-09-09
Polishing Pad Having Insulation Layer And Method For Making The Same App 20100146863 - Feng; Chung-Chih ; et al.	2010-06-17
Conductive Polishing Pad And Method For Making The Same App 20100119811 - Feng; Chung-Chih ; et al.	2010-05-13
Polishing Pad Having Abrasive Grains And Method For Making The Same App 20100099343 - Feng; Chung-Chih ; et al.	2010-04-22
Polishing pad having groove structure for avoiding stripping of a polishing surface of the polishing pad Grant 7,662,028 - Feng , et al. February 16, 2	2010-02-16
Polishing Pad Having Groove Structure For Avoiding The Polishing Surface Stripping App 20090258587 - Feng; Chung-Chih ; et al.	2009-10-15

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