Besi Switzerland AG

Patent Applications and Registrations

Patent applications and USPTO patent grants for Besi Switzerland AG.The latest application filed is for "die ejector".

Company Profile

10.26.31

Besi Switzerland AG - Steinhausen CH
BESI SWITZERLAND AG - Cham CH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Die Ejector App 20210391205 - Hurschler; Fabian ; et al.	2021-12-16
Actuator for a Bonding Head App 20210272925 - Aebischer; Markus	2021-09-02
Apparatus and Method for Detaching a Die from an Adhesive Film App 20210265302 - Mayr; Andreas ; et al.	2021-08-26
Apparatus and method for mounting components on a substrate App 20210195816 - BILEWICZ; Norbert ; et al.	2021-06-24
Apparatus and method for mounting components on a substrate Grant 10,973,158 - Bilewicz , et al. April 6, 2	2021-04-06
Method for calibrating a component mounting apparatus Grant 10,629,465 - Handlos , et al.	2020-04-21
Method for calibrating a component mounting apparatus App 20190362998 - HANDLOS; Harald ; et al.	2019-11-28
Bonding head for mounting components and die bonder with such a bonding head App 20190157122 - KROEHNERT; Rene	2019-05-23
Apparatus for mounting components on a substrate Grant 10,288,413 - Bilewicz , et al.	2019-05-14
Apparatus and method for mounting components on a substrate App 20180317353 - BILEWICZ; Norbert ; et al.	2018-11-01
Kinematic holding system for a placement head of a placement apparatus Grant 9,956,692 - Kostner , et al. May 1, 2	2018-05-01
Device for dispensing and distributing flux-free solder on a substrate Grant 9,889,516 - Stroemberg , et al. February 13, 2	2018-02-13
Method for mounting semiconductors provided with bumps on substrate locations of a substrate Grant 9,721,819 - Speer August 1, 2	2017-08-01
Through type furnace for substrates comprising a longitudinal slit Grant 9,666,460 - Suter , et al. May 30, 2	2017-05-30
Apparatus For Mounting Components On A Substrate App 20170092613 - Bilewicz; Norbert ; et al.	2017-03-30
Method For Mounting Semiconductors Provided With Bumps On Substrate Locations Of A Substrate App 20170062257 - Speer; Florian	2017-03-02
Apparatus For Dispensing Flux-Free Solder On A Substrate App 20160256949 - Berchtold; Heinrich ; et al.	2016-09-08
Kinematic Holding System For A Placement Head Of A Placement Apparatus App 20160167237 - Kostner; Hannes ; et al.	2016-06-16
Kinematic holding system for a placement head of a placement apparatus Grant 9,364,953 - Kostner , et al. June 14, 2	2016-06-14
Method and apparatus for dispensing flux-free solder on a substrate Grant 9,339,885 - Berchtold , et al. May 17, 2	2016-05-17
Method for detaching a semiconductor chip from a foil Grant 9,240,334 - Barmettler , et al. January 19, 2	2016-01-19
Device for dispensing adhesive on a substrate Grant 9,233,389 - Grueter , et al. January 12, 2	2016-01-12
Method for detaching a semiconductor chip from a foil Grant 9,039,867 - Barmettler , et al. May 26, 2	2015-05-26
Through-Type Furnace For Substrates To Be Fitted With Components And Die Bonder App 20150136836 - Suter; Guido ; et al.	2015-05-21
Device For Dispensing And Distributing Flux-Free Solder On A Substrate App 20150008249 - Stroemberg; Christoffer ; et al.	2015-01-08
Bonding head with a heatable and coolable suction member Grant 8,925,608 - Mayr January 6, 2	2015-01-06
Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate App 20140311652 - Kostner; Hannes ; et al.	2014-10-23
Device For Dispensing Adhesive On A Substrate App 20140305372 - Grueter; Ruedi ; et al.	2014-10-16
Bonding Head With A Heatable And Coolable Suction Member App 20140202636 - Mayr; Andreas	2014-07-24
Method For Detaching A Semiconductor Chip From A Foil App 20140196853 - Barmettler; Ernst ; et al.	2014-07-17
Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A Substrate App 20140175159 - Kostner; Hannes	2014-06-26
Kinematic Holding System For A Placement Head Of A Placement Apparatus App 20140030052 - Kostner; Hannes ; et al.	2014-01-30
Method And Apparatus For Dispensing Flux-Free Solder On A Substrate App 20140008421 - Berchtold; Heinrich ; et al.	2014-01-09
Method For Detaching A Semiconductor Chip From A Foil App 20130255889 - Barmettler; Ernst ; et al.	2013-10-03

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