loadpatents
Patent applications and USPTO patent grants for Bersuch; Larry R..The latest application filed is for "z-pin closeout joint and method of assembly".
Patent | Date |
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Paste-bond clevis joint Grant 7,198,692 - Bersuch , et al. April 3, 2 | 2007-04-03 |
Z-pin closeout joint and method of assembly App 20050186390 - Bersuch, Larry R. ;   et al. | 2005-08-25 |
Paste-bond clevis joint App 20050139314 - Bersuch, Larry R. ;   et al. | 2005-06-30 |
Methods of hot-melt impregnation of 3-D, woven, textile preforms Grant 6,911,175 - Benson , et al. June 28, 2 | 2005-06-28 |
Paste-bond clevis joint Grant 6,863,767 - Bersuch , et al. March 8, 2 | 2005-03-08 |
Co-bonded joint with Z-pins Grant 6,821,368 - Benson , et al. November 23, 2 | 2004-11-23 |
Methods of hot-melt impregnation of 3-D, woven, textile preforms App 20040104516 - Benson, Ross A. ;   et al. | 2004-06-03 |
Three-dimensional weave architecture Grant 6,712,099 - Schmidt , et al. March 30, 2 | 2004-03-30 |
Z-pin closeout joint and method of assembly App 20040023581 - Bersuch, Larry R. ;   et al. | 2004-02-05 |
Methods of hot-melt resin impregnation of 3-D, woven, textile preforms Grant 6,676,882 - Benson , et al. January 13, 2 | 2004-01-13 |
Co-bonded joint with Z-pins App 20030066589 - Benson, Ross A. ;   et al. | 2003-04-10 |
Methods of hot-melt resin impregnation of 3-D, woven, textile preforms App 20030042659 - Benson, Ross A. ;   et al. | 2003-03-06 |
Co-cured joint with Z-pins App 20030041948 - Bersuch, Larry R. ;   et al. | 2003-03-06 |
Paste-bond clevis joint App 20030037867 - Bersuch, Larry R. ;   et al. | 2003-02-27 |
Three-dimensional weave architecture App 20020192450 - Schmidt, Ronald P. ;   et al. | 2002-12-19 |
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