Berry; Michele J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Berry; Michele J..The latest application filed is for "encapsulation of pin solder for maintaining accuracy in pin position".

Company Profile

0.5.5

Berry; Michele J. - Chandler AZ
Berry; Michele J. - Carrboro NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Encapsulation of pin solder for maintaining accuracy in pin position Grant 7,211,888 - Berry May 1, 2	2007-05-01
Metal ball attachment of heat dissipation devices Grant 6,992,891 - Mallik , et al. January 31, 2	2006-01-31
Encapsulation of pin solder for maintaining accuracy in pin position App 20050275094 - Berry, Michele J.	2005-12-15
Encapsulation of pin solder for maintaining accuracy in pin position Grant 6,974,765 - Berry December 13, 2	2005-12-13
Wafer-level packaging of electronic devices before singulation Grant 6,867,060 - Greathouse , et al. March 15, 2	2005-03-15
Metal ball attachment of heat dissipation devices App 20040196634 - Mallik, Debendra ; et al.	2004-10-07
Wafer-level packaging of electronic devices before singulation App 20040099917 - Greathouse, Steve ; et al.	2004-05-27
Packaging microelectromechanical systems App 20030183916 - Heck, John ; et al.	2003-10-02
Encapsulation of pin solder for maintaining accuracy in pin position App 20030057572 - Berry, Michele J.	2003-03-27
Encapsulated micro-relay modules and methods of fabricating same Grant 6,025,767 - Kellam , et al. February 15, 2	2000-02-15

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