Beroz; Masud

Patent Applications and Registrations

Patent applications and USPTO patent grants for Beroz; Masud.The latest application filed is for "high yield substrate assembly".

Company Profile

1.80.95

Beroz; Masud - Apex NC
Beroz; Masud - Morrisville NC
Beroz; Masud - Cary NC
Beroz; Masud - San Jose CA
Beroz; Masud - Livermore CA
Beroz; Masud - Milpitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
CTE compensation for wafer-level and chip-scale packages and assemblies Grant 10,847,469 - Vanhille , et al. November 24, 2	2020-11-24
High yield substrate assembly Grant 10,748,858 - Wang , et al. A	2020-08-18
High Yield Substrate Assembly App 20190341361 - Wang; Liang ; et al.	2019-11-07
High yield substrate assembly Grant 10,396,041 - Wang , et al. A	2019-08-27
Fluid pressure activated electrical contact devices and methods Grant 10,128,601 - Beroz November 13, 2	2018-11-13
Fluid pressure activated electrical contact devices and methods Grant 10,003,149 - Beroz June 19, 2	2018-06-19
Inverted optical device Grant 9,947,643 - Mohammed , et al. April 17, 2	2018-04-17
Fluid Pressure Activated Electrical Contact Devices and Methods App 20180048084 - Beroz; Masud	2018-02-15
Heat spreading substrate with embedded interconnects Grant 9,842,745 - Mohammed , et al. December 12, 2	2017-12-12
Cte Compensation For Wafer-level And Chip-scale Packages And Assemblies App 20170330836 - Vanhille; Kenneth J. ; et al.	2017-11-16
Multiplexing, switching and testing devices and methods using fluid pressure Grant 9,805,891 - Beroz October 31, 2	2017-10-31
High Yield Substrate Assembly App 20170179046 - Wang; Liang ; et al.	2017-06-22
Quantum efficiency of multiple quantum wells Grant 9,583,671 - Wang , et al. February 28, 2	2017-02-28
Fluid pressure activated electrical contact devices and methods Grant 9,577,358 - Beroz February 21, 2	2017-02-21
Stacked packaging improvements Grant 9,570,416 - Haba , et al. February 14, 2	2017-02-14
Inverted Optical Device App 20160204091 - Mohammed; Ilyas ; et al.	2016-07-14
Multiplexing, Switching And Testing Devices And Methods Using Fluid Pressure App 20160118210 - Beroz; Masud	2016-04-28
Fluid Pressure Activated Electrical Contact Devices and Methods App 20160118737 - Beroz; Masud	2016-04-28
Inverted optical device Grant 9,293,641 - Mohammed , et al. March 22, 2	2016-03-22
Stacked Packaging Improvements App 20160035692 - Haba; Belgacem ; et al.	2016-02-04
Stacked packaging improvements Grant 9,153,562 - Haba , et al. October 6, 2	2015-10-06
Optical Enhancement Of Light Emitting Devices App 20150263252 - Wang; Liang ; et al.	2015-09-17
Front Facing Piggyback Wafer Assembly App 20150228633 - Mohammed; Ilyas ; et al.	2015-08-13
High Yield Substrate Assembly App 20150171027 - Wang; Liang ; et al.	2015-06-18
Quantum Efficiency Of Multiple Quantum Wells App 20150171265 - Wang; Liang ; et al.	2015-06-18
Heat spreading substrate with embedded interconnects App 20150132894 - Mohammed; Ilyas ; et al.	2015-05-14
Stacked Packaging Improvements App 20150102508 - Haba; Belgacem ; et al.	2015-04-16
Quantum efficiency of multiple quantum wells Grant 8,975,616 - Wang , et al. March 10, 2	2015-03-10
Three dimensional interposer device Grant 8,963,013 - Beroz February 24, 2	2015-02-24
Heat spreading substrate with embedded interconnects Grant 8,946,757 - Mohammed , et al. February 3, 2	2015-02-03
Stacked packaging improvements Grant 8,927,337 - Haba , et al. January 6, 2	2015-01-06
Front facing piggyback wafer assembly Grant 8,912,024 - Mohammed , et al. December 16, 2	2014-12-16
High yield substrate assembly Grant 8,900,974 - Wang , et al. December 2, 2	2014-12-02
High yield substrate assembly Grant 8,841,204 - Wang , et al. September 23, 2	2014-09-23
Optical Enhancement Of Light Emitting Devices App 20140008676 - Wang; Liang ; et al.	2014-01-09
Quantum Efficiency Of Multiple Quantum Wells App 20140008607 - Wang; Liang ; et al.	2014-01-09
Stacked Packaging Improvements App 20130344682 - Haba; Belgacem ; et al.	2013-12-26
High Yield Substrate Assembly App 20130288412 - WANG; Liang ; et al.	2013-10-31
Stacked packaging improvements Grant 8,531,020 - Haba , et al. September 10, 2	2013-09-10
Stacked packaging improvements Grant 8,525,314 - Haba , et al. September 3, 2	2013-09-03
Heat Spreading Substrate With Embedded Interconnects App 20130214296 - Mohammed; Ilyas ; et al.	2013-08-22
High Yield Substrate Assembly App 20130126867 - Wang; Liang ; et al.	2013-05-23
Inverted Optical Device App 20130126921 - Mohammed; Ilyas ; et al.	2013-05-23
Front Facing Piggyback Wafer Assembly App 20130127364 - Mohammed; Ilyas ; et al.	2013-05-23
Microelectronic packages and methods therefor Grant 8,329,581 - Haba , et al. December 11, 2	2012-12-11
Microelectronic package comprising offset conductive posts on compliant layer Grant 8,207,604 - Haba , et al. June 26, 2	2012-06-26
Three Dimensional Interposer Device, Chip Package And Probe Card Contactor App 20120138343 - Beroz; Masud	2012-06-07
Microelectronic Packages And Methods Therefor App 20110269272 - Haba; Belgacem ; et al.	2011-11-03
Small chips with fan-out leads Grant 8,039,363 - Beroz , et al. October 18, 2	2011-10-18
Microelectronic connection component Grant 8,039,959 - Beroz October 18, 2	2011-10-18
Microelectronic packages and methods therefor Grant 7,999,397 - Haba , et al. August 16, 2	2011-08-16
System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures Grant 7,989,940 - Haba , et al. August 2, 2	2011-08-02
Stacked Packaging Improvements App 20110042810 - Haba; Belgacem ; et al.	2011-02-24
Formation of circuitry with modification of feature height Grant 7,816,251 - Haba , et al. October 19, 2	2010-10-19
Microelectronic Packages And Methods Therefor App 20100258956 - Haba; Belgacem ; et al.	2010-10-14
Methods for forming connection structures for microelectronic devices Grant 7,793,414 - Haba , et al. September 14, 2	2010-09-14
Microelectronic package having interconnected redistribution paths Grant 7,768,117 - Haba , et al. August 3, 2	2010-08-03
Microelectonic packages and methods therefor Grant 7,745,943 - Haba , et al. June 29, 2	2010-06-29
Microelectronic packages and methods therefor Grant 7,554,206 - Haba , et al. June 30, 2	2009-06-30
Stacked Packaging Improvements App 20090104736 - Haba; Belgacem ; et al.	2009-04-23
Formation of circuitry with modification of feature height App 20090071000 - Haba; Belgacem ; et al.	2009-03-19
Formation of circuitry with modification of feature height Grant 7,462,936 - Haba , et al. December 9, 2	2008-12-09
Packages and assemblies including lidded chips App 20080296717 - Beroz; Masud ; et al.	2008-12-04
Transmission line stacking App 20080296748 - Haba; Belgacem ; et al.	2008-12-04
Microelectronic packages and methods therefor Grant 7,453,157 - Haba , et al. November 18, 2	2008-11-18
Components with conductive solder mask layers Grant 7,427,423 - Beroz , et al. September 23, 2	2008-09-23
Microelectronic packages and methods therefor App 20080185705 - Osborn; Philip R. ; et al.	2008-08-07
Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates Grant 7,361,979 - Beroz , et al. April 22, 2	2008-04-22
Structure and method of forming capped chips Grant 7,351,641 - Haba , et al. April 1, 2	2008-04-01
Selective removal of dielectric materials and plating process using same Grant 7,332,068 - Haba , et al. February 19, 2	2008-02-19
Structure and method of making lidded chips App 20080029879 - Tuckerman; David B. ; et al.	2008-02-07
Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold Grant 7,309,447 - Light , et al. December 18, 2	2007-12-18
Method of making assemblies having stacked semiconductor chips Grant 7,288,433 - Haba , et al. October 30, 2	2007-10-30
High-frequency chip packages Grant 7,268,426 - Warner , et al. September 11, 2	2007-09-11
Microelectronic connection components having bondable wires Grant 7,268,304 - Beroz , et al. September 11, 2	2007-09-11
Microelectronic packages and methods therefor App 20070205496 - Haba; Belgacem ; et al.	2007-09-06
Connection structures for microelectronic devices and methods for forming such structures Grant 7,262,368 - Haba , et al. August 28, 2	2007-08-28
Microelectronic connection component App 20070108613 - Beroz; Masud	2007-05-17
Small chips with fan-out leads App 20070105346 - Beroz; Masud ; et al.	2007-05-10
High frequency chip packages with connecting elements App 20070096160 - Beroz; Masud ; et al.	2007-05-03
Methods for forming connection structures for microelectronic devices App 20070094874 - Haba; Belgacem ; et al.	2007-05-03
Assemblies for temporarily connecting microelectronic elements for testing and methods therefor Grant 7,205,659 - Beroz , et al. April 17, 2	2007-04-17
Microelectronic packages and methods therefor App 20070077677 - Haba; Belgacem ; et al.	2007-04-05
Microelectronic packages and methods therefor Grant 7,176,043 - Haba , et al. February 13, 2	2007-02-13
High frequency chip packages with connecting elements Grant 7,176,506 - Beroz , et al. February 13, 2	2007-02-13
Enhancements in framed sheet processing Grant 7,152,311 - Beroz , et al. December 26, 2	2006-12-26
Building Unit And Method Of Constructing Buildings Therewith App 20060283119 - Beroz; Masud ; et al.	2006-12-21
Microelectronic assemblies having low profile connections App 20060275951 - Warner; Michael ; et al.	2006-12-07
Microelectronic assemblies having low profile connections Grant 7,098,074 - Warner , et al. August 29, 2	2006-08-29
Components with solder masks App 20060157534 - Beroz; Masud	2006-07-20
Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates App 20060138640 - Beroz; Masud ; et al.	2006-06-29
Microelectronic assemblies incorporating inductors App 20060113645 - Warner; Michael ; et al.	2006-06-01
Microelectronic assemblies and methods of making microelectronic assemblies App 20060108698 - Beroz; Masud ; et al.	2006-05-25
Microelectronic assemblies incorporating inductors Grant 7,012,323 - Warner , et al. March 14, 2	2006-03-14
Structure and method of forming capped chips App 20060033189 - Haba; Belgacem ; et al.	2006-02-16
Connection structures for microelectronic devices and methods for forming such structures App 20060032670 - Haba; Belgacem ; et al.	2006-02-16
Structure with spherical contact pins App 20060027899 - Humpston; Giles ; et al.	2006-02-09
Structure and method of making an enhanced surface area capacitor App 20060014357 - Beroz; Masud	2006-01-19
Chip handling methods and apparatus App 20060013680 - Haba; Belgacem ; et al.	2006-01-19
Microelectronic packages and methods therefor App 20050285246 - Haba, Belgacem ; et al.	2005-12-29
Structure and method of making an enhanced surface area capacitor Grant 6,972,473 - Beroz December 6, 2	2005-12-06
Microelectronic connection components having bondable wires App 20050243529 - Beroz, Masud ; et al.	2005-11-03
Methods of making microelectronic packages Grant 6,959,489 - Beroz , et al. November 1, 2	2005-11-01
Method of making assemblies having stacked semiconductor chips App 20050233496 - Haba, Belgacem ; et al.	2005-10-20
Assemblies having stacked semiconductor chips and methods of making same Grant 6,940,158 - Haba , et al. September 6, 2	2005-09-06
Microelectronic packages and methods therefor App 20050181544 - Haba, Belgacem ; et al.	2005-08-18
Micro pin grid array with wiping action App 20050181655 - Haba, Belgacem ; et al.	2005-08-18
Method of making microelectronic packages including electrically and/or thermally conductive element App 20050167814 - Beroz, Masud ; et al.	2005-08-04
Methods of making microelectronic assemblies App 20050155223 - Fjelstad, Joseph ; et al.	2005-07-21
Forming thin layer structures by ablation App 20050146839 - Beroz, Masud	2005-07-07
System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures App 20050133899 - Haba, Belgacem ; et al.	2005-06-23
System and method for increasing the ball pitch of an electronic circuit package App 20050133891 - Beroz, Masud ; et al.	2005-06-23
System and method for increasing the number of IO-s on a ball grid pattern App 20050133915 - Beroz, Masud	2005-06-23
Formation of circuitry with modification of feature height App 20050116326 - Haba, Belgacem ; et al.	2005-06-02
Simplified stacked chip assemblies App 20050082658 - Beroz, Masud	2005-04-21
Methods of making microelectronic packages including electrically and/or thermally conductive element Grant 6,873,039 - Beroz , et al. March 29, 2	2005-03-29
Method of making a microelectronic assembly Grant 6,867,065 - Beroz March 15, 2	2005-03-15
Structure and method of making an enhanced surface area capacitor App 20050035390 - Beroz, Masud	2005-02-17
Microelectric packages having deformed bonded leads and methods therefor Grant 6,848,173 - Fjelstad , et al. February 1, 2	2005-02-01
High-frequency chip packages App 20040238934 - Warner, Michael ; et al.	2004-12-02
Assemblies having stacked semiconductor chips and methods of making same App 20040238931 - Haba, Belgacem ; et al.	2004-12-02
High frequency chip packages with connecting elements App 20040238857 - Beroz, Masud ; et al.	2004-12-02
Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold App 20040224535 - Light, David ; et al.	2004-11-11
Selective removal of dielectric materials and plating process using same App 20040217088 - Haba, Belgacem ; et al.	2004-11-04
Microelectronic assemblies having low profile connections App 20040219716 - Warner, Michael ; et al.	2004-11-04
Assemblies for temporarily connecting microelectronic elements for testing and methods therefor Grant 6,794,202 - Beroz , et al. September 21, 2	2004-09-21
Assemblies for temporarily connecting microelectronic elements for testing and methods therefor App 20040159959 - Beroz, Masud ; et al.	2004-08-19
Methods of making microelectronic packages including electrically and/or thermally conductive element App 20040157362 - Beroz, Masud ; et al.	2004-08-12
Selective removal of dielectric materials and plating process using same Grant 6,758,984 - Haba , et al. July 6, 2	2004-07-06
Microelectronic unit forming methods and materials Grant 6,737,265 - Beroz , et al. May 18, 2	2004-05-18
Simplified stacked chip assemblies App 20040089930 - Beroz, Masud	2004-05-13
Method of making a microelectronic assembly App 20040043551 - Beroz, Masud	2004-03-04
Microelectronic joining processes App 20040035519 - Beroz, Masud ; et al.	2004-02-26
Microelectronic assemblies incorporating inductors App 20040032011 - Warner, Michael ; et al.	2004-02-19
Microelectronic joining processes Grant 6,651,321 - Beroz , et al. November 25, 2	2003-11-25
Framed sheets Grant 6,541,852 - Beroz , et al. April 1, 2	2003-04-01
Microelectronic unit forming methods and materials App 20030060032 - Beroz, Masud ; et al.	2003-03-27
Microelectronic joining processes App 20030041451 - Beroz, Masud ; et al.	2003-03-06
Methods of making a connection component using a removable layer Grant 6,461,892 - Beroz October 8, 2	2002-10-08
Wave strip injection form App 20020105792 - Beroz, Masud ; et al.	2002-08-08
Wet etch process and composition for forming openings in a polymer substrate App 20020084248 - Kong, Bobwen Zhont ; et al.	2002-07-04
Enhancements in framed sheet processing App 20020068384 - Beroz, Masud ; et al.	2002-06-06
Microelectronic packages having deformed bonded leads and methods therefor App 20020068426 - Fjelstad, Joseph ; et al.	2002-06-06
Lead formation using grids Grant 6,384,475 - Beroz , et al. May 7, 2	2002-05-07
Methods of making a connection component App 20020031905 - Beroz, Masud	2002-03-14
Selective removal of dielectric materials and plating process using same App 20020011421 - Haba, Belgacem ; et al.	2002-01-31
Microelectronic unit forming methods and materials App 20020009827 - Beroz, Masud ; et al.	2002-01-24
Enhancements in framed sheet processing Grant 6,338,982 - Beroz , et al. January 15, 2	2002-01-15
Components with conductive solder mask layers App 20020003160 - Beroz, Masud ; et al.	2002-01-10
Framed sheets App 20010050425 - Beroz, Masud ; et al.	2001-12-13
Components with conductive solder mask layers Grant 6,329,605 - Beroz , et al. December 11, 2	2001-12-11
Assemblies for temporarily connecting microelectronic elements for testing and methods therefor App 20010023985 - Beroz, Masud ; et al.	2001-09-27
Components with releasable leads and methods of making releasable leads Grant 6,261,863 - Beroz , et al. July 17, 2	2001-07-17
Components with releasable leads and methods of making releasable leads App 20010006253 - Beroz, Masud ; et al.	2001-07-05
Framed sheet processing Grant 6,228,685 - Beroz , et al. May 8, 2	2001-05-08
Enhancements in framed sheet processing Grant 6,217,972 - Beroz , et al. April 17, 2	2001-04-17
Method of manufacturing a plurality of semiconductor packages Grant 6,214,640 - Fosberry , et al. April 10, 2	2001-04-10
Multilayer structure with interlocking protrusions Grant 6,188,028 - Haba , et al. February 13, 2	2001-02-13
Lead formation usings grids Grant 6,063,648 - Beroz , et al. May 16, 2	2000-05-16