Bernig; Walter

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bernig; Walter.The latest application filed is for "thermofomable packaging material with shrink properties".

Company Profile

0.4.8

Bernig; Walter - Durach DE
Bernig; Walter - Rettenberg DE
Bernig; Walter - Munich DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermoformable, heat-sealable and heat-shrinkable multilayer film and method of using the film for producing packaging trays and packages Grant 8,424,273 - Bernig , et al. April 23, 2	2013-04-23
Heat-shrinkable multilayer films Grant 7,722,936 - Bernig , et al. May 25, 2	2010-05-25
Thermofomable Packaging Material With Shrink Properties App 20090301035 - Bernig; Walter ; et al.	2009-12-10
Packaging Which Is Suitable For Microwaves App 20090123614 - Bernig; Walter ; et al.	2009-05-14
Thermoformable Packaging Material Exhibiting Shrinking Properties App 20080152772 - Bernig; Walter ; et al.	2008-06-26
Thermoformable Multilayer Film App 20080131675 - Fackler; Tobias ; et al.	2008-06-05
Transparent Deep Drawn Anti-Fog Films App 20080113133 - Fackler; Tobias ; et al.	2008-05-15
Packaging Material Comprising a Foamed Polyolefin Layer App 20080020162 - Fackler; Tobias ; et al.	2008-01-24
Heat-Shrinkable Multilayer Films App 20070298198 - Bernig; Walter ; et al.	2007-12-27
Film comprising a gas barrier layer App 20060110554 - Bernig; Walter ; et al.	2006-05-25
Fusion adhesive which can comprise an isocyanate prepolymer, a thermoplastic polymer and/or a lower molecular weight ketone resin Grant 4,585,819 - Reischle , et al. April 29, 1	1986-04-29

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