Patent | Date |
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Plating system for semiconductor materials Grant 7,087,143 - Schmidt , et al. August 8, 2 | 2006-08-08 |
Modular semiconductor workpiece processing tool Grant 7,074,246 - Berner , et al. July 11, 2 | 2006-07-11 |
Semiconductor processing system with wafer container docking and loading station Grant 6,960,257 - Thompson , et al. November 1, 2 | 2005-11-01 |
Modular semiconductor workpiece processing tool App 20050193537 - Berner, Robert W. ;   et al. | 2005-09-08 |
Cathode current control system for a wafer electroplating apparatus Grant 6,843,894 - Berner , et al. January 18, 2 | 2005-01-18 |
Semiconductor processing system with wafer container docking and loading station Grant 6,833,035 - Thompson , et al. December 21, 2 | 2004-12-21 |
Contact assembly for supplying power to workpieces during electrochemical processing Grant 6,805,778 - Batz, Jr. , et al. October 19, 2 | 2004-10-19 |
Cathode current control system for a wafer electroplating apparatus App 20040055879 - Berner, Robert W. ;   et al. | 2004-03-25 |
Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot App 20040035707 - Batz, Robert W. JR. ;   et al. | 2004-02-26 |
Semiconductor processing system with wafer container docking and loading station App 20030202871 - Thompson, Raymon F. ;   et al. | 2003-10-30 |
Cathode current control system for a wafer electroplating apparatus Grant 6,627,051 - Berner , et al. September 30, 2 | 2003-09-30 |
Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas App 20030029732 - Ritzdorf, Thomas L. ;   et al. | 2003-02-13 |
Modular semiconductor workpiece processing tool App 20020194716 - Berner, Robert W. ;   et al. | 2002-12-26 |
Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas Grant 6,454,926 - Ritzdorf , et al. September 24, 2 | 2002-09-24 |
Cathode current control system for a wafer electroplating apparatus App 20020003084 - Berner, Robert W. ;   et al. | 2002-01-10 |
Cathode current control system for a wafer electroplating apparatus Grant 6,322,674 - Berner , et al. November 27, 2 | 2001-11-27 |
Modular semiconductor workpiece processing tool App 20010030101 - Berner, Robert W. ;   et al. | 2001-10-18 |
Modular semiconductor workpiece processing tool Grant 6,203,582 - Berner , et al. March 20, 2 | 2001-03-20 |
Semiconductor processing using vapor mixtures Grant 6,162,734 - Bergman , et al. December 19, 2 | 2000-12-19 |
Cathode current control system for a wafer electroplating apparatus Grant 6,139,703 - Hanson , et al. October 31, 2 | 2000-10-31 |
Process architecture and manufacturing tool sets employing hard mask patterning for use in the manufacture of one or more metallization levels on a workpiece Grant 6,120,641 - Stevens , et al. September 19, 2 | 2000-09-19 |
Semiconductor wafer processing system Grant 6,014,817 - Thompson , et al. January 18, 2 | 2000-01-18 |
Cathode current control system for a wafer electroplating apparatus Grant 6,004,440 - Hanson , et al. December 21, 1 | 1999-12-21 |
Semiconductor processing systems Grant 5,882,168 - Thompson , et al. March 16, 1 | 1999-03-16 |
Semiconductor processing system with wafer container docking and loading station Grant 5,836,736 - Thompson , et al. November 17, 1 | 1998-11-17 |
Carrierless centrifugal semiconductor processing system Grant 5,784,797 - Curtis , et al. July 28, 1 | 1998-07-28 |
Semiconductor processing systems Grant 5,784,802 - Thompson , et al. July 28, 1 | 1998-07-28 |
Processing head for semiconductor processing machines Grant 5,731,678 - Zila , et al. March 24, 1 | 1998-03-24 |
Semiconductor processing systems Grant 5,678,320 - Thompson , et al. October 21, 1 | 1997-10-21 |
Semiconductor processing system with wafer container docking and loading station Grant 5,660,517 - Thompson , et al. August 26, 1 | 1997-08-26 |
Semiconductor wafer processing system Grant 5,544,421 - Thompson , et al. August 13, 1 | 1996-08-13 |