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name:-0.011384963989258
name:-0.0067849159240723
name:-0.0061280727386475
Bernards; Roger Patent Filings

Bernards; Roger

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bernards; Roger.The latest application filed is for "high elongation electroless copper process".

Company Profile
2.4.9
  • Bernards; Roger - Goshen CT
  • Bernards; Roger - South Haven MN
  • Bernards; Roger - Buffalo MN
  • Bernards; Roger - Wellesley MA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
High Elongation Electroless Copper Process
App 20220081776 - Bernards; Roger
2022-03-17
Gold Plating Bath and Gold Plated Final Finish
App 20210371998 - Bernards; Roger ;   et al.
2021-12-02
Carbon-Based Direct Plating Process
App 20210204412 - Bernards; Roger ;   et al.
2021-07-01
Carbon-based direct plating process
Grant 10,986,738 - Bernards , et al. April 20, 2
2021-04-20
Carbon-Based Direct Plating Process
App 20190350089 - Bernards; Roger ;   et al.
2019-11-14
Copper Plating Solutions and Method of Making and Using Such Solutions
App 20140299480 - Bernards; Roger ;   et al.
2014-10-09
Method for roughening copper surfaces for bonding to substrates
Grant 7,351,353 - Bernards , et al. April 1, 2
2008-04-01
Method for roughening copper surfaces for bonding to substrates
Grant 7,153,445 - Bernards , et al. December 26, 2
2006-12-26
Method for roughening copper surfaces for bonding to substrates
App 20060191869 - Bernards; Roger ;   et al.
2006-08-31
Method for roughening copper surfaces for bonding to substrates
App 20040048486 - Bernards, Roger ;   et al.
2004-03-11
Method for roughening copper surfaces for bonding to substrates
App 20020084441 - Bernards, Roger ;   et al.
2002-07-04
Method for analyzing organic additives in an electroplating bath
Grant 5,223,118 - Sonnenberg , et al. June 29, 1
1993-06-29

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