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Patent applications and USPTO patent grants for Bernards; Roger.The latest application filed is for "high elongation electroless copper process".
Patent | Date |
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High Elongation Electroless Copper Process App 20220081776 - Bernards; Roger | 2022-03-17 |
Gold Plating Bath and Gold Plated Final Finish App 20210371998 - Bernards; Roger ;   et al. | 2021-12-02 |
Carbon-Based Direct Plating Process App 20210204412 - Bernards; Roger ;   et al. | 2021-07-01 |
Carbon-based direct plating process Grant 10,986,738 - Bernards , et al. April 20, 2 | 2021-04-20 |
Carbon-Based Direct Plating Process App 20190350089 - Bernards; Roger ;   et al. | 2019-11-14 |
Copper Plating Solutions and Method of Making and Using Such Solutions App 20140299480 - Bernards; Roger ;   et al. | 2014-10-09 |
Method for roughening copper surfaces for bonding to substrates Grant 7,351,353 - Bernards , et al. April 1, 2 | 2008-04-01 |
Method for roughening copper surfaces for bonding to substrates Grant 7,153,445 - Bernards , et al. December 26, 2 | 2006-12-26 |
Method for roughening copper surfaces for bonding to substrates App 20060191869 - Bernards; Roger ;   et al. | 2006-08-31 |
Method for roughening copper surfaces for bonding to substrates App 20040048486 - Bernards, Roger ;   et al. | 2004-03-11 |
Method for roughening copper surfaces for bonding to substrates App 20020084441 - Bernards, Roger ;   et al. | 2002-07-04 |
Method for analyzing organic additives in an electroplating bath Grant 5,223,118 - Sonnenberg , et al. June 29, 1 | 1993-06-29 |
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